JPH07150366A - Selective plating method and production of circuit board - Google Patents

Abstract

PURPOSE:To provide a highly practical selective plating method capable of coping adequately with a plating on the surface of a substrate or the pattern of a circuit and to furnish a circuit board. CONSTITUTION:The area of the surface of a substrate not to be plated is irradiated with an electromagnetic beam to inhibit the catalytic function of the area or to selectively remove a metallic film on the area, and then a plating film is formed on the unirradiated part. In this case, the substrate and the electromagnetic beam are relatively moved to transfer the position to be irradiated with the beam and to control the width of the area to be irradiated with the beam, and a specified electromagnetic beam is used.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a selective plating method and a circuit board manufacturing method using the selective plating method.

[0002]

2. Description of the Related Art Conventionally, there is a method of obtaining a circuit board by selective plating on the surface of a base material without using a resist mask. In this case, the surface of the base material is subjected to a treatment to impart a catalytic function by the adhesion of the plating catalyst, and then the activity of the plating catalyst in the unnecessary plating area is removed by irradiating a laser beam on the unnecessary plating area of the base material surface. Therefore, the catalytic function is lost,
A selective plating method is used in which a plating film is selectively formed on a plating-required area on the surface of the base material which has not been irradiated with a laser beam (Japanese Patent Laid-Open No. 61-6892).

This conventional selective plating method has an advantage that a resist mask is not required, but has a problem that pattern compatibility is low. For example, depending on the laser beam irradiation pattern, it takes a long time to irradiate the laser beam, or depending on the base material, the circuit pattern accuracy may not be sufficient, and the controllability of the edge shape of the circuit pattern may be poor. It does.

Prolongation of laser beam irradiation occurs in the case of a circuit pattern (plating pattern) having a fine portion in the laser beam irradiation pattern. The deterioration of the circuit pattern accuracy occurs when the surface of the base material to be plated has irregularities (three-dimensional shape). The problem of controllability of the edge shape of the circuit pattern arises when it is desired to perform plating with the edges being strictly straight edges.

[0005]

SUMMARY OF THE INVENTION In view of the above circumstances, the present invention provides a method of selective plating and a method of manufacturing a circuit board, which is highly practical in terms of plating applied to the surface of a base material and circuit pattern compatibility. Is an issue.

[0006]

In order to solve the above-mentioned problems, in the selective plating method according to the present invention, after the base material surface is subjected to a treatment for imparting a plating catalyst function or a treatment for forming a metal film, Select the desired surface of the base material that has not been irradiated with an electromagnetic wave beam by selectively erasing the plating catalyst function or the metal film in the unnecessary plating area by irradiating the surface of the material with the electromagnetic wave beam. In forming the plating film as a first embodiment, as a first form, the irradiation position of the electromagnetic beam on the plating unnecessary area is moved by the relative movement of the base material and the electromagnetic beam, and the spot shape of the electromagnetic beam and As a second mode, the irradiation width of the electromagnetic wave beam is controlled by changing at least one of the moving speeds. The irradiation position of the electromagnetic wave beam on the plating unnecessary area is moved by the relative movement of the electromagnetic wave beam, and the irradiation width of the electromagnetic wave beam on the substrate surface is measured during or immediately after irradiation, and based on this measurement result As a third embodiment, the irradiation width of the electromagnetic wave beam is controlled, and the irradiation position of the electromagnetic wave beam on the plating unnecessary area is moved by the relative movement of the base material and the electromagnetic wave beam. Irradiation of the electromagnetic wave on the non-plating area is performed by a relative movement of the base material and the electromagnetic beam as a fourth form, which has an uneven shape and controls the irradiation width of the electromagnetic beam according to the uneven shape. A fifth mode is adopted in which the position is moved and a laser beam in a beam mode having a sharp energy distribution periphery is used as the electromagnetic wave beam. Together to, for moving the irradiation position of the electromagnetic wave beam on plating unnecessary region by the relative movement of the substrate and the electromagnetic wave beam,
The sixth embodiment has a configuration in which the electromagnetic wave beam is irradiated through a beam shaping mask that shields the edges of the electromagnetic wave beam. As a sixth mode, the relative movement of the base material and the electromagnetic wave beam causes While the irradiation position is moved, the spot shape of the electromagnetic wave beam is set to any one of a square shape, an oblong shape, and an oval shape. The movement of the irradiation position of the electromagnetic wave beam on the unnecessary plating area is performed by such movement, and the relative vibration is superimposed on the relative movement of the base material and the electromagnetic wave beam. The relative movement of the base material and the electromagnetic wave beam moves the irradiation position of the electromagnetic wave beam on the unnecessary plating area, and the irradiation of the electromagnetic wave beam In a ninth embodiment, the beam spots adjacent to each other in the moving direction are partially overlapped with each other on the outer circumference. The irradiation position of the electromagnetic wave beam above is moved, and the irradiation of the electromagnetic wave beam is performed in a pulse shape, and adjacent beam spots in the moving direction (marks irradiated in a spot shape) partially overlap each other on their outer circumferences. In addition, the intermittent movement of the beam spots between the adjacent columns is performed by shifting the mutual movement pitches by about ½ pitch.

Examples of the treatment for imparting the plating catalyst function in the present invention include a treatment for electroless plating in which a substrate is immersed in a liquid containing Pd, followed by activation treatment and nucleation of Pd. In this case, the plating catalyst function disappearance form by irradiation of the electromagnetic wave beam may be a form of removing or deactivating the catalyst itself. In the former case of removing the catalyst, it is preferable to remove a part of the base material at the same time because the removal is sure.

In the case of the present invention, it is also a useful mode to irradiate an electromagnetic wave beam by using a base material having a layer having a high absorption rate for the electromagnetic wave beam on the surface thereof.
Applying Pd, A for plating catalyst function and metal film formation
When at least one of g, Au, Cu, Ni, Cr, and its alloys is a plating catalyst layer or a metal film, the electromagnetic wave absorption rate is low, and therefore a layer having a high electromagnetic wave absorption rate is present on the surface. Is preferable. Applying Pd, Ag, A for plating catalyst function and metal film formation
A form in which an alloy of u, Cu, Ni, and Cr and an element that lowers thermal conductivity and / or an element that has a low melting point and a high vapor pressure is used is also preferable because it can be reliably erased by irradiation with an electromagnetic wave beam.

Examples of the substrate used in the selective plating method of the present invention include, but are not limited to, resin-based insulating substrates such as ABS, polyetherimide and liquid crystal polymer, and ceramic insulating substrates such as alumina ceramics. Not done. The substrate is useful as long as it is made of a laser transparent material, but it may be made of a laser non transparent material. The surfaces of these insulating base materials are usually roughened (provided with fine irregularities) in advance. In this case, a base material in which only the plating-required area is selectively roughened is used as the base material. It is preferable. This is because when the plating unnecessary area is a non-roughened surface, the plating catalyst function disappears and the metal film for the plating underlayer is surely removed by the irradiation of the electromagnetic wave.

In the case of the present invention, the irradiation width of the electromagnetic wave beam for irradiating the non-plating area is controlled, for example, by adjusting the beam spot shape (spot shape and size) and moving speed, but is not limited thereto. . When a circuit is formed on the surface of the base material, the irradiation pattern of the electromagnetic wave beam is the reverse pattern of the circuit pattern. Therefore, it is necessary to use the CAD information of the circuit pattern formed on the surface of the base material as the data for controlling the irradiation of the electromagnetic wave beam. Can proceed efficiently.

According to the selective plating method of the present invention, a three-dimensional circuit board can be manufactured by forming a plating film having a predetermined circuit pattern on the surface of a three-dimensional (concave-convex) base material. It goes without saying that it may be used for purposes other than manufacturing. The plating method in this invention is
There are electroless plating, electroplating, a combination of both, etc., and is not limited to a specific plating method.

[0012]

[Function] The width of the electromagnetic beam irradiating the non-plating area can be changed by changing the beam spot shape and moving speed.
If the width of the irradiation beam is controlled in a fine manner, it is possible to perform the treatment quickly without spending too much time on the thick portion. When the irradiation width is measured during or immediately after the irradiation of the electromagnetic wave beam that irradiates the non-plating area, and the irradiation width of the electromagnetic wave beam is controlled based on this measurement result, there is unevenness on the surface of the base material, and there are variations in the irradiation position Even if it occurs or the beam irradiation angle changes, the irradiation width of the irradiation beam is always kept at a desired value, so that the plating pattern is accurate.

When the irradiation width of the electromagnetic wave beam for irradiating the non-plating area is controlled according to the uneven shape of the base material surface, there is unevenness on the base material surface, which causes fluctuations in the irradiation position or fluctuations in the beam irradiation angle. However, since the width of the irradiation beam is maintained at a desired value, the plating pattern is accurate. When a laser beam with a sharp energy distribution periphery and a sharp boundary is used as an electromagnetic wave beam for irradiating the non-plating area, the boundary between the plated area and the non-plated area after plating is clear and the finishing accuracy is improved.

The electromagnetic beam for irradiating the non-plating area is
When the substrate surface is irradiated through a beam shaping mask that blocks the edges of the electromagnetic wave, the peripheral edge of the laser beam is cut by the mask to form a laser beam with clear boundaries,
Even when a laser beam for performing pulsed irradiation is used, the boundary between the plated area and the non-plated area after plating is clear, and the finishing accuracy is improved.

When the spot shape of the electromagnetic beam for irradiating the non-plating area is a square shape, an oblong shape, or an oval shape, the edge shape of the corner of the irradiation pattern can be obtained.
Even when using a laser beam for pulsed irradiation,
The boundary between the plated area and the non-plated area after plating is clear, and the finishing accuracy is improved, and when the laser beam is moved in the direction of the long side of the spot shape, high-speed drawing (scanning) is possible.

When relative vibration is superimposed on the relative movement of the electromagnetic wave beam irradiating the non-plating area and the base material, the boundary between the plated area and the non-plated area after the plating is completed is clear and the finishing accuracy is improved. Moreover, an irradiation pattern thicker than that of the spot system can be drawn by one scanning. A sharp-pointed metal that can be used for surge arresters for circuit protection, by making pulse spots (intermittently) irradiate the non-plating area in a pulse direction so that adjacent beam spots in the movement direction partially overlap each other on their outer circumferences. It can be formed by the facing structure of the membrane.

An electromagnetic wave beam to be applied to a non-plating area in a pulsed (intermittent) manner is such that beam spots adjacent to each other in the moving direction partially overlap each other on their outer circumferences, and a beam between adjacent rows is formed. If the spots are intermittently moved such that the movement pitches of the spots are shifted from each other by about 1/2 pitch, the facing distance of the pointed portions of the metal film becomes longer, discharge is less likely to occur, and insulation deterioration is suppressed.

When a base material in which only the plating-required area is selectively roughened is used as the base material, the roughening is not carried out in the portion where the catalytic function is lost or the portion where the metal film is removed, and therefore the catalyst The removal, passivation, or metal removal is ensured so that the plating film is not formed in the plating unnecessary region, and the plating film is firmly attached because the plating required region is the roughened surface.

If a part of the base material is also scraped off when the laser beam is applied to the non-plating area, the catalyst or the metal film is surely removed, and the plating film is formed in the non-plating area. There is no such thing. By irradiating an electromagnetic wave beam with a layer having a high electromagnetic wave absorptivity formed on the surface of the base material, even if the laser beam has a low energy, it is possible to surely remove the catalyst, deactivate it, or remove the metal.

Pd, Ag, Au, Cu, N on the surface of the substrate
When a plating catalyst function imparting process or a metal film forming process is performed using an alloy of i, Cr and an element that lowers thermal conductivity and / or an element having a low melting point and a high vapor pressure, a catalyst layer or a metal film is formed. Since it is easily removed, the catalyst can be removed and deactivated or the metal film can be reliably removed even with a low energy laser beam.

As the data for controlling the irradiation of the electromagnetic wave,
By using the CAD information of the circuit pattern formed on the surface of the base material, it becomes possible to quickly determine the irradiation position and spot diameter (irradiation width) of the CAD information. When a base material made of a laser-transmissive material is used, it is possible to easily control the laser beam irradiation conditions, solve the problem of scattered matter, and simultaneously process a plurality of sheets.

By plating the surface of a three-dimensional base material by the selective plating method of the present invention, a three-dimensional circuit board can be obtained.

[0023]

Embodiments of the present invention will be described below. Of course,
The present invention is not limited to the embodiments described below. -Example 1-Example 1 is a circuit in which the width (scanning line width) of the electromagnetic wave beam irradiated to the substrate surface in the selective plating process is changed by changing the beam spot shape (shape and size) and moving speed. Get the board.

When changing the spot shape, the defocus amount of the electromagnetic wave beam or the energy intensity is adjusted. In the case of adjusting the defocus amount, as shown in FIG. 1, if the defocus amount is reduced (focused) by moving the irradiation system or the substrate along the Z-axis, the width of the electromagnetic wave beam becomes narrower. The larger the focus amount, the wider the electromagnetic beam. In the case of adjusting the energy intensity, as shown in FIG. 2, a laser of a mode having a smooth energy distribution such as Gaussian distribution is used for the electromagnetic wave beam. However, if the amount of oscillation energy is increased, the width of the electromagnetic wave beam becomes wider, If it is reduced to, the width of the electromagnetic beam becomes narrower. When changing the moving speed, as shown in Fig. 3,
An electromagnetic wave beam is used for a laser in a mode having a smooth energy distribution such as a Gaussian distribution. However, if the moving speed (scanning speed) is slowed down, the width of the electromagnetic wave beam will be widened. Narrows.

The surface of an insulating base material such as ABS, polyetherimide, liquid crystal polymer, or alumina ceramics is roughened by treating it with a chromic acid solution, KOH aqueous solution, phosphoric acid or the like. The insulating base material is dipped in a liquid containing Pd and then activated to carry out Pd nucleation (adding a plating catalyst function). A laser (for example,
YAG laser). The spot diameter of the laser beam is changed according to the pattern width of the plating unnecessary area. Figure 4
As shown in (a) of (a), the fine beam 6 is moved (drawn) at a high speed in a fine portion such as between the circuit patterns 5, and the thick beam 7 is moved (drawn) in a wide portion at a low speed. The substrate 1 and the beams 6 and 7 are moved relative to each other, and the non-plating area is laser-scanned. At this time, for example, as shown in FIG. 1, the thin beam 6 and the thick beam 7 are switched by changing the focal length of the lens that focuses the laser or the distance between the substrate 1 and the lens. An extremely thin beam can be obtained by matching the surface of the base material 1 with the focal point of the lens. The laser power is, for example, 0.1 to 1 J / cm ^2.
The moving speed and the laser oscillation intensity are adjusted so as to be about the same level.

Of course, as shown in FIG. 2, the thin beam 6 and the thick beam 7 may be switched by increasing / decreasing the oscillation energy amount, or, as shown in FIG. 3, by adjusting the moving speed (scanning speed). It is also possible to switch between the thin beam 6 and the thick beam 7. The laser intensity or moving speed is adjusted so that the pattern width of the plating unnecessary area on the surface of the base material and the width of the portion of the beam where the laser influence is, for example, 0.1 to 1 J / cm ² or more match. Specifically, in the case of the thin beam 6, the amount of oscillation energy is decreased or the moving speed is increased, and in the case of the thick beam 7, the amount of oscillation energy is increased or the moving speed is decreased.

Further, as shown in FIG. 4B, when a wide portion is irradiated with a thick beam 7, some irradiation leakage occurs at the edges and corners of the pattern. Therefore, the thin beam 6 is irradiated onto the irradiation leakage portion. It is desirable to eliminate irradiation leakage. The shape of the edge becomes more accurate. By this laser beam irradiation, Pd in the plating unnecessary area is removed or inactivated, and the catalytic function disappears.

After disappearance of the catalytic function, the circuit board is obtained by immersing in a non-electrolytic copper plating solution and performing electroless copper plating only on the plating-required area where the laser beam has not been irradiated. Example 1
Since the width of the irradiation beam is controlled according to the thickness of the pattern in the non-plating area, the thick portion can be processed quickly without unnecessary time. -Example 2-In Example 2, the irradiation width of the electromagnetic wave beam irradiated to the substrate surface in the selective plating process was measured during irradiation or immediately after irradiation,
The circuit board is obtained by controlling the irradiation width of the electromagnetic wave beam based on the measurement result. If the surface of the base material has irregularities, the irradiation width of the electromagnetic wave beam varies depending on the irradiation position. Therefore, the irradiation width is constantly monitored and fed back to obtain an accurate irradiation width.

The surface of an insulating base material such as ABS, polyetherimide, liquid crystal polymer, or alumina ceramics is roughened by treating it with a chromic acid solution, KOH aqueous solution, phosphoric acid or the like. The insulating base material is dipped in a liquid containing Pd and then activated to carry out Pd nucleation (adding a plating catalyst function). A laser (for example,
CW-YAG laser) beam is applied. At this time, as shown in FIG. 5, the laser is focused by a lens through a galvanometer mirror and irradiated to scan the entire area of the non-plating area on the surface of the insulating base material 1, while the insulating base material 1 is scanned. The substrate 1 so that the distance between the laser optical system and
Set it on the table. The focus state changes as the Z table moves, and the irradiation width of the laser beam can be changed. By doing so, it becomes possible to control the defocus amount of the laser beam by changing the distance between the substrate 1 and the laser optical system so that the irradiation width of the laser beam always has a desired value.

On the other hand, the irradiation width (spot size) on the surface of the substrate 1 immediately after or during the laser irradiation is, for example, T
It is monitored by a V camera, image processed, measured, and fed back to the drive system of the Z table. By doing so, even if the irradiation width deviates from the predetermined value due to the fluctuation of the irradiation position or the beam irradiation angle due to the unevenness of the surface of the base material 1, the Z table moves immediately and the Z position is adjusted to ensure accurate irradiation. Feedback control is performed so that the width becomes wide.

The laser power is, for example, 0.1 to 1 J /
The moving speed and the laser oscillation intensity are adjusted to be about cm ² . By this laser beam irradiation, Pd in the plating unnecessary area is removed or inactivated, and the catalytic function disappears. After the catalytic function disappears, dip it in an electroless copper plating solution,
A circuit board can be obtained by performing electroless copper plating only on the plating-required area that has not been irradiated with the laser beam.

In addition to this, a laser beam with a gentle energy distribution may be used to perform feedback control of the irradiation width by increasing or decreasing the amount of oscillation energy as shown in FIG. 2, or as shown in FIG. Feedback control of the irradiation width may be performed by adjusting (scanning speed). As in the case of Example 1, the laser intensity or the moving speed is set so that the pattern width of the non-plating area on the surface of the base material and the width of the portion where the laser influence in the beam is, for example, 0.1 to 1 J / cm ² or more match. Adjust to.

In Example 2, there was unevenness on the surface of the substrate,
The circuit pattern is accurate because the width of the irradiation beam is always kept at a desired value even if the irradiation position changes in height or the beam irradiation angle changes. -Example 3 In Example 3, a circuit board is obtained by controlling the irradiation width of the electromagnetic wave beam according to the uneven shape of the substrate surface in the selective plating process.
The height of the irradiation point on the surface of the base material and the beam irradiation angle to the base material are input as data in advance so that the desired irradiation width can be achieved at that point, or the height of the irradiation point while irradiating the beam The inclination angle is measured and these are input as data so that the desired irradiation width is obtained at that point, but the invention is not limited to this.

The surface of an insulating base material such as polyimide, ABS, polyetherimide, liquid crystal polymer, or alumina ceramics is plasma-treated to be roughened. Cu, Ni, Pd,
A metal (conductive) film of Cr, Ag or the like is formed to a thickness of 0.1 to 2 μm, and is used as a metal film for a plating base. As shown in FIG. 6, a laser (for example, a Q-switch YAG laser) beam is focused on a non-plating area on the surface of the base material by a lens through a galvanometer mirror and irradiated.
The whole area of the plating unnecessary area pattern on the surface of the insulating substrate 1 is scanned.

On the other hand, the scattered light from the surface of the base material 1 is observed by a camera from a position away from the laser beam irradiation viewpoint, and the Z position is determined again from the difference between the XY data of the laser beam irradiation and the irradiation point observation data by the camera, and Z. The slope is measured from the change in position (see FIG. 7). Then, the scanning speed of the laser beam is controlled based on the data of the Z position and the inclination, that is, based on the uneven shape of the substrate surface, and the irradiation intensity of the laser beam exceeds the threshold value at which the metal film can be removed. The width is set to a constant thickness (for example, a diameter of 150 μm). You may remove a part of base material simultaneously with a metal film. The laser power is, for example, about 0.05 to 1 J / cm ² .

The process of calculating the z position (AS) based on FIG. 7 is as follows. A (x, y, 0): projection point of the irradiation point on the reference plane (XY plane), S (x, y, 0)
z): irradiation point, S1 (x1, y1, z1): irradiation point observed by the camera, C (0, 0, h): camera position. On the other hand, OC: known, A: known from irradiation data, S
1: Observed value of the camera. And AS: OC = AS
1: OS1, therefore AS = OC × ASI ÷ OS
It becomes 1.

By this laser beam irradiation, the metal film in the plating unnecessary region is removed, and the metal film remains only in the plating required region of the circuit pattern. Electroplating is selectively performed using the remaining metal film as a cathode. A bridge pattern for power supply is formed during laser beam irradiation so that all parts requiring plating are energized, and a resist to prevent plating adhesion is applied to this part with an inkjet or dispenser and then electroplating. Good to do. After electroplating, remove the resist,
The underlying metal film is removed by light etching.

The irradiation width of the laser beam (beam diameter)
The control may be performed by adjusting the defocus amount in FIG. 1 or adjusting the energy intensity in FIG. The electroplating is, for example, copper plating (thickness 10 μm). If necessary, solder resist, Ni plating, and Au plating are applied. For example,
After copper plating in the above process, a solder resist is applied and patterned to form a Ni plating required portion and / or Au.
Ni plating and / or Au plating may be performed by electroless plating with the required plating portion exposed.

In Example 3, there was unevenness on the surface of the substrate,
The circuit pattern is accurate because the width of the irradiation beam is kept at a desired value even if the irradiation position changes in height or the beam irradiation angle changes. -Example 4- In Example 4, in the selective plating process, (b) of FIG.
As shown in Fig. 8A, the electromagnetic energy beam is not a laser beam in a mode in which the energy distribution around the periphery is gentle and the boundary is unclear. A circuit board is obtained using a laser beam with a sharp boundary mode (annular mode = ring mode, etc.). This annular mode laser beam can be obtained by, for example, the optical system shown in FIG.

The surface of an insulating base material such as ABS, polyetherimide, liquid crystal polymer, alumina ceramics is treated with a chromic acid solution, a KOH aqueous solution, phosphoric acid or the like to be roughened. The insulating base material is dipped in a liquid containing Pd and then activated to carry out Pd nucleation (adding a plating catalyst function). A laser (for example,
YAG laser) beam is applied. The laser is focused by a lens and irradiated, while the substrate and the laser beam are moved relative to each other to scan the entire area of the non-plating area on the surface of the insulating substrate.

With this laser beam irradiation, P
d is removed or deactivated and loses its catalytic function. After the catalytic function disappears, dip it in an electroless copper plating solution,
A circuit board can be obtained by performing electroless copper plating only on the plating-required area that has not been irradiated with the laser beam. In Example 4, since a laser beam having a clear boundary is used, the boundary between the plated area and the non-plated area after the plating is clear and the finishing accuracy is improved.

Example 5 In Example 5, in the selective plating process, as shown in FIG. 10, the surface of the substrate 1 is irradiated with an electromagnetic wave beam through a beam shaping mask that shields the edges of the electromagnetic wave beam. To get the circuit board. The surface of the insulating base material such as polyimide, ABS, polyetherimide, liquid crystal polymer, and alumina ceramics having a flat surface or an uneven surface is roughened by plasma treatment.

Cu on the surface of the substrate by sputtering,
Add a metal (conductive) film of Ni, Pd, Cr, Ag, etc.
It is formed to have a thickness of 2 μm and is used as a metal film for a plating base. A laser (for example, a Q-switch YAG laser) beam is focused by a lens through a galvanometer mirror and irradiated along the contour of the non-plating area on the surface of the base material to scan the surface of the insulating base material. At this time, a laser beam is emitted through a beam shaping mask having a light-shielding portion having the same pattern as the circuit pattern and a window having an almost same shape as the plating unnecessary area. Then, the low-energy portion of the periphery of the laser beam is cut, and the boundary between the laser beam irradiation portion and the non-irradiation portion becomes clear. The laser power is, for example, about 0.05 to 1 J / cm ² . A part of the base material may be cut at the same time as the metal film.

As shown in FIG. 11, even if the laser beam is pulsed (intermittently) and there is a gap above and below adjacent spots, that portion is cut and the edge is linear. By this laser beam irradiation, the metal film in the plating unnecessary area is removed, and the metal film remains only in the plating area of the circuit pattern.

Electroplating is selectively performed using the remaining metal film as a cathode. A bridge pattern for power supply is formed during laser beam irradiation so that all parts requiring plating are energized, and a resist to prevent plating adhesion is applied to this part with an inkjet or dispenser and then electroplating. Good to do. After electroplating, the resist is peeled off and the metal film on the insulating surface is removed by light etching.

The electroplating is, for example, copper plating (thickness 10
μm). If necessary, solder resist, Ni
Apply plating and Au plating. For example, after the copper plating in the above step, a solder resist is applied and patterned to expose the Ni-plating required portion and / or the Au-plating required portion, and perform the electroless plating for Ni-plating and / or Au-plating.
It is good to plate.

In the fifth embodiment, the edge of the laser beam is cut with a mask to form a laser beam with a clear boundary. Therefore, even when a laser beam for performing pulsed irradiation is used, after the plating is completed, The boundary between the plated and non-plated areas is clear and the finishing accuracy is improved. -Example 6-In Example 6, in the selective plating process, the spot shape of the electromagnetic wave beam 3 is a square shape as shown in FIG. 12 (a) or a long square shape as shown in FIG. 12 (b). Alternatively, as shown in FIG. 12C, an elliptic circuit board is obtained. Such various spot shapes of the laser beam 3 are created by using an optical element such as an aperture, a mask, a lens or a prism. The direction of the long side can be changed by rotating an optical element such as an aperture, a mask, a lens or a prism.

The surface of the insulating base material such as polyimide, ABS, polyetherimide, liquid crystal polymer, alumina ceramics or the like having a flat surface or an uneven surface is roughened by plasma treatment. Cu, Ni, Pd,
A metal (conductive) film of Cr, Ag or the like is formed to a thickness of 0.1 to 2 μm, and is used as a metal film for a plating base. A laser (eg, Q-switch YAG laser) beam is focused by a lens, for example, via a galvanometer mirror, and irradiated along a contour line of a plating-free area on the surface of the base material to scan the surface of the insulating base material. . At this time, the spot shape of the laser beam is made into a rectangular shape by a combination of a beam expanding lens and a cylindrical lens, and the cylindrical lens is rotated so that the moving direction of the beam coincides with the long side of the rectangular shape.

The laser power is, for example, 0.05 to 1 J.
It is about / cm ² . A part of the base material may be cut at the same time as the metal film. By this laser beam irradiation, the metal film in the plating unnecessary area is removed, and the metal film remains only in the plating area of the circuit pattern. Electroplating is selectively performed using the remaining metal film as a cathode. A bridge pattern for power supply is formed during laser beam irradiation so that all parts requiring plating are energized, and a resist to prevent plating adhesion is applied to this part with an inkjet or dispenser and then electroplating. Good to do. After electroplating, remove the resist,
The metal film on the insulating surface is removed by light etching.

The electroplating is carried out, for example, by copper plating (thickness 10
μm). If necessary, solder resist, Ni
Apply plating and Au plating. For example, after the copper plating in the above step, a solder resist is applied and patterned to expose the Ni-plating required portion and / or the Au-plating required portion, and perform the electroless plating for Ni-plating and / or Au-plating.
It is good to plate.

In the sixth embodiment, since the spot shape of the laser beam is a square shape, an oblong shape or an elliptic shape, the edge shape of the corner portion of the irradiation pattern can be obtained, and a laser beam for performing pulsed irradiation is used. Even in this case, the boundary between the plated area and the non-plated area after the plating is clear and the finishing accuracy is improved, and when the laser beam is moved in the direction of the long side of the spot shape, high-speed drawing (scanning) is possible.

Example 7 In Example 7, in the selective plating process, as shown in FIG. 13, in addition to the relative movement of the base material and the electromagnetic wave beam 3, relative vibration in the direction along the plane was observed. Also go to finally get the circuit board. The surface of the insulating base material such as ABS, polyether imide, liquid crystal polymer, alumina ceramics is coated with chromic acid solution, K
It is roughened by treatment with an OH aqueous solution, phosphoric acid and the like.

The insulating base material is immersed in a liquid containing Pd and then activated to carry out Pd nucleation (to impart a plating catalyst function). A laser (for example,
YAG laser) beam is applied. The laser is focused by a lens and irradiated, while the substrate and the laser beam are moved relative to each other to scan the entire area of the non-plating area on the surface of the insulating substrate. Then, in the seventh embodiment, at this time, as shown in FIG. 13, in addition to the normal movement, the relative vibration in the direction along the relative plane is superimposed. In addition,
The oscillation period is preferably selected so that a multiple of the half period is one pulse of the laser beam.

If the direction of the vibration to be applied is the same as that of the normal movement (scanning), the edge becomes linear even when a pulsed laser beam is used, as shown in FIG. When the direction of the vibration to be applied is not the same as that of the normal movement (scanning), for example, orthogonal, the vibration period is selected so that a multiple of half cycle is one pulse of the laser beam, or if a continuous wave laser is used, A pattern of amplitude + thickness of spot system can be drawn with one scan.

With this laser beam irradiation, P
d is removed or deactivated and loses its catalytic function. After the catalytic function disappears, dip it in an electroless copper plating solution,
A circuit board can be obtained by performing electroless copper plating only on the plating-required area that has not been irradiated with the laser beam. In Example 7, even when the irradiation width of the laser beam was not controlled, the boundary between the plated area and the non-plated area after plating was clear and the finishing accuracy was high even when a laser beam for pulsed irradiation was used. Moreover, the irradiation pattern thicker than the spot system can be drawn by one scanning.

Example 8 In Example 8, in the selective plating process, as shown in FIG. 14 (a) or 14 (b), pulsed (intermittent).
The circuit board is finally obtained by making the beam spots (marks of spots) adjacent to each other in the moving direction of the electromagnetic wave beam 3 irradiating the laser beam partially overlap each other on their outer circumferences. For example, in the obtained circuit board, a surge arrester for circuit protection is formed.

The surface of the insulating base material such as polyimide, ABS, polyetherimide, liquid crystal polymer, alumina ceramics, etc. having a flat surface or an uneven surface is roughened by plasma treatment. W, Cu, Ni, P on the substrate surface by sputtering etc.
A metal film of d, Cr, Ag, or the like is formed to a thickness of 0.1 to 2 μm to form a metal film for a plating base. A laser (for example, a Q-switch YAG laser) beam is focused onto a non-plating area on the surface of the base material by a lens, for example, via a galvanometer mirror, and the insulating base material surface is scanned. At this time, as indicated by the alternate long and short dash line in FIG. 14A, the spot-shaped quadrangular laser beam that is generated intermittently in a pulse shape is inclined and irradiated, and adjacent quadrangular beam spot traces are formed on each outer periphery. If the laser beams of spot-shaped circular laser beams that are pulse-shaped are irradiated so as to overlap each other or partially overlap each other at the outer circumferences of the circular beam spots, as shown by the dashed line in FIG. Do it It should be noted that in the case of a laser beam having a spot-shaped quadrilateral, the positional relationship is such that the entire facing edges are not overlapped.

The laser power is, for example, 0.05 to 1 J.
It is about / cm ² . A part of the base material may be cut at the same time as the metal film. By this laser beam irradiation, the metal film in the plating unnecessary area is removed, and the metal film remains only in the plating area of the circuit pattern. Using the remaining metal film as a cathode, electroplating is selectively performed to obtain a circuit board. The plating substance is a metal or compound having a low work function value.

In the circuit board obtained in Example 8, at the position 14 where the beam spots overlap each other in the circuit 4, it is possible to form a facing structure of a metal film having a sharp tip. The shape of the tip, the angle, the positional relationship facing each other, and the distance can be adjusted by the spot shape and size of the laser beam and the stacking method. In this face-to-face structure, when high-voltage noise is applied, discharge easily occurs due to electrolytic concentration at the tip, so this face-to-face structure can be used as a circuit protection surge arrester.

Embodiment 9 In Embodiment 9, as shown in FIG. 15, in the process of the selective plating method, the electromagnetic wave beam 3 radiated in a pulse shape (intermittently) is irradiated with a beam spot (spot) adjacent to the moving direction. Marks are continuously irradiated with each other, and the intermittent movement of the beam spots between adjacent rows is such that the movement pitches of the beam spots are shifted by 1/2 pitch. Finally, the circuit board is obtained.

The surface of an insulating base material such as ABS, polyetherimide, liquid crystal polymer, or alumina ceramics is roughened by treating with a chromic acid solution, KOH aqueous solution, phosphoric acid or the like. The insulating base material is dipped in a liquid containing Pd and then activated to carry out Pd nucleation (adding a plating catalyst function). A laser (for example,
YAG laser) beam is applied. The laser is focused by a lens and irradiated, while the substrate and the laser beam are moved relative to each other to scan the entire area of the non-plating area on the surface of the insulating substrate. Then, in the ninth embodiment, at this time, the irradiation movement of the electromagnetic wave beam 3 that is pulsed is performed in a plurality of rows of two or more rows, and the irradiation of the electromagnetic wave beam 3 is performed by the beam spot traces adjacent to each other in the movement direction. , And the intermittent movement of the beam spots between adjacent columns is such that the movement pitches of the beam spots are shifted by 1/2 pitch.

With this laser beam irradiation, P
d is removed or deactivated and loses its catalytic function. After the catalytic function disappears, dip it in an electroless copper plating solution,
A circuit board can be obtained by performing electroless copper plating only on the plating-required area that has not been irradiated with the laser beam. In the circuit board obtained in Example 9, at the position 14 where the peripheral portions of the beam spots in the circuit 4 overlap with each other, the metal film portion protrudes in a sharp state, and the electrolysis is likely to be concentrated to cause discharge, resulting in insulation. It causes deterioration. However, in this case, the intermittent movement of beam spots between adjacent rows has a mutual movement pitch of 1
The pitches are shifted by 1/2 pitch, and as a result, the interval between the sharp portions of the metal film portion becomes longer, so that discharge is less likely to occur and insulation deterioration is suppressed.

Example 10 In Example 10, as shown in FIG. 16 (a), a circuit board is obtained by using the substrate 1 in which only the plating required area 1a is selectively roughened. As shown in FIG. 16 (a), Ar is applied only to the required plating area on the surface of the insulating base material such as polyimide, ABS, polyetherimide, liquid crystal polymer, and alumina ceramics.
Irradiation with F excimer laser at an intensity of 0.1 to 0.5 J / cm ² is performed to selectively roughen. This selective roughening may be performed by a method of roughening the surface of the portion of the molding die to be subjected to selective plating and transferring it.

After the roughening, as shown in FIG. 16B, the insulating base material is dipped in a liquid containing Pd and then activated to carry out Pd nucleation (adding a plating catalyst function). As shown in FIG. 16C, a laser (for example, YAG laser) beam is applied to the non-plating area on the surface of the insulating base material by the same method as in Examples 1 to 9. By this laser beam irradiation, Pd in the plating unnecessary area is removed or inactivated, and the catalytic function disappears.

After disappearance of the catalytic function, as shown in FIG. 16 (c), the circuit board is immersed in an electroless copper plating solution, and electroless copper plating is applied only to a plating-required area not irradiated with a laser beam. Is obtained. In addition, the circuit board may be obtained as follows. The insulating substrate is selectively roughened in the same manner as above.

Cu on the surface of the substrate by sputtering or the like,
Add a metal (conductive) film of Ni, Pd, Cr, Ag, etc.
It is formed to have a thickness of 2 μm and is used as a metal film for a plating base. A laser (for example,
A Q-switched YAG laser beam is applied in the same manner as in Examples 1-9. By this laser beam irradiation, the metal film in the plating unnecessary area is removed, and the metal film remains only in the plating area of the circuit pattern.

Using the remaining metal film as a cathode, electroplating is selectively performed to obtain a circuit board. In the case of Example 10, since the portion where the catalytic function is lost and the portion where the metal film is removed are not roughened, the removal of the catalyst, the deactivation or the metal removal is surely performed, and the plating film is not formed in the plating unnecessary area. It is not generated, and since the plating required area is a roughened surface, the plating film is firmly attached.

-Embodiment 11-In Embodiment 11, as shown in FIG. 17 (b), a circuit board is obtained by shaving a part of the base material 1 upon irradiation with a laser beam. The surface of the insulating base material such as ABS, polyetherimide, liquid crystal polymer, alumina ceramics is coated with chromic acid or KO.
It is roughened by treatment with an aqueous solution of H, phosphoric acid and the like.

After the roughening, as shown in FIG. 17A, the insulating base material 1 is dipped in a liquid containing Pd and then activated to perform Pd nucleation (adding a plating catalyst function). . As shown in FIG. 17B, a laser (for example, YAG laser) beam is applied to the non-plating area on the surface of the insulating base material in the same manner as in Examples 1 to 10. This laser beam irradiation is performed so as to scrape the surface of the insulating base material in the unnecessary plating region together with Pd, and the laser irradiation energy is set to about 5 to 50 J / cm ² .

After removing Pd, as shown in FIG. 17C, the circuit board is obtained by immersing in an electroless copper plating solution and performing electroless copper plating only on the plating-required area not irradiated with the laser beam. To be In addition, the circuit board may be obtained as follows. The surface of an insulating base material such as polyimide, ABS, polyetherimide, liquid crystal polymer, or alumina ceramics is plasma-treated to be roughened.

Cu on the surface of the substrate by sputtering or the like,
A metal film of Ni, Pd, Cr, Ag, or the like is formed to a thickness of 0.1 to 2 μm to form a metal film for a plating base. A laser (for example,
A Q-switched YAG laser beam is applied in the same manner as in Examples 1-10. This laser beam irradiation is carried out so as to scrape off the surface of the non-plating area of the insulating base material together with the metal film.
500 μJ / pulse.

By this laser beam irradiation, the metal film in the plating unnecessary region is removed, and the metal film remains only in the plating required region of the circuit pattern. Using the remaining metal film as a cathode, electroplating is selectively performed to obtain a circuit board. In the case of Example 10, since the insulating base material is also partially scraped, the removal of the catalyst or the removal of the metal film is ensured, and the plating film is not formed in the plating unnecessary area.

Example 12 In Example 12, as shown in FIG. 18C, a base material having a layer (oxide layer 22) having a high electromagnetic wave absorption rate on the surface was used, and the electromagnetic wave absorptivity was high. Irradiate an electromagnetic beam onto the layer. Pd, Ag, Au, Cu, Ni, C on the substrate surface
At least one of r and its alloys is formed as a plating catalyst material layer or a metal film for a plating base, but these layers have a low electromagnetic wave absorptivity, so that they are irradiated with a beam in an improved state. To do.

FIG. 18 shows polyimide, ABS, polyetherimide, liquid crystal polymer, alumina ceramics, etc.
The surface of the insulating base material as shown in (a) of FIG. 0.1% of Cu etc. on the substrate surface by sputtering etc.
Deposited to a thickness of ˜2 μm, and a metal film 21 is formed as shown in FIG.

The surface of the metal film of Cu or the like is heated to about 100 ° C. in the atmosphere for about 1 minute, and as shown in FIG. 18C, the oxide layer 22 is formed on the surface of the metal film as a layer having a high electromagnetic wave absorption rate. Form. The oxide layer 22 may be continuously formed on the metal film by another method such as introducing oxygen gas during sputtering at the end of the metal film formation. A laser (for example,
A Q-switched YAG laser beam is applied in the same manner as in Examples 1 to 11, as shown in FIG.

The energy of this laser beam irradiation is 1
It is set to 0 to 300 μJ / pulse. You may carry out so that the surface of the plating unnecessary area part of an insulating base material may be shaved off with a metal film. By this laser beam irradiation, the metal film in the plating unnecessary area is removed, and the metal film remains only in the plating area of the circuit pattern.

Electroplating is selectively performed using the remaining metal film as a cathode to obtain a circuit board. Alternatively, the circuit board may be obtained as follows. Similar to the above, the surface of the insulating base material is roughened. Cu, Ni, P on the surface of the substrate by sputtering etc.
A metal film of d, Cr, Ag or the like is formed to a thickness of 0.1 to 2 μm to form a metal film.

If the metal film is Cu, Ni
If i, carbon black is formed as a layer having a high electromagnetic wave absorption rate. After this, a circuit board is obtained in the same manner as above. In the case of Example 12, since the laser beam absorptance is high, even if the laser beam of low energy is used, the removal of the catalyst, the deactivation, and the removal of the metal are surely performed, and the base material is not damaged. No unevenness is formed at the edge of the non-irradiated area or the metal film or plating film is not peeled off.

Example 13 In Example 13, Pd, Ag, Au, Cu and N were formed on the surface of the base material.
An alloy of i, Cr and an element that reduces thermal conductivity and / or an element that has a low melting point and a high vapor pressure is used to perform a plating catalyst function imparting process or a metal film forming process to obtain a circuit board. The surface of an insulating base material such as polyimide, ABS, polyetherimide, liquid crystal polymer, or alumina ceramics is plasma-treated to be roughened.

A metal (conductive) film of, for example, Cu-10% to 20% Zn alloy is formed to a thickness of 0.1 to 2 μm on the surface of the base material by sputtering or the like, and as shown in FIG. , The metal film 22 is formed. It is desirable to form the metal film 22 after plasma treatment without exposing it to the atmosphere. A laser (for example,
A Q-switched YAG laser beam is applied in the same manner as in Examples 1 to 11, as shown in FIG.

The energy of this laser beam irradiation is 1
It is set to 0 to 300 μJ / pulse. You may carry out so that the surface of the plating unnecessary area part of an insulating base material may be shaved off with a metal film. By this laser beam irradiation, the metal film in the plating unnecessary area is removed, and the metal film remains only in the plating area of the circuit pattern.

The remaining metal film is used as a cathode for electroplating or electroless plating to obtain a circuit board.
Alternatively, the circuit board may be obtained as follows. The surface of the insulating base material is roughened in the same manner as described above. For example, Cu-A on the substrate surface by sputtering or the like.
A metal film having a low thermal conductivity such as a 1-alloy is formed with a thickness of 0.1 to 2 μm.

Laser beam irradiation is performed in the same manner as described above, and the metal film is left only in the plating-required area of the circuit pattern. Plating is performed in the same manner as above to obtain a circuit board. In the case of Example 13, an element having a low melting point and a high vapor pressure (for example, Zn
(Sn, Sn, etc.) makes it possible to remove the metal layer, etc. at a relatively low temperature. Therefore, even with a low-energy laser beam, it is possible to reliably remove the catalyst, deactivate it, or remove the metal film, and damage the substrate. There is no unevenness at the edge of the non-irradiated area or peeling of the metal film or plating film due to damage to the base material.

Example 14 In Example 14, CAD information of the circuit pattern formed on the surface of the base material is used as the irradiation control data of the electromagnetic beam in the selective plating process. The CAD information is used as basic data for determining the irradiation position and the spot diameter (irradiation width). The circuit / non-circuit boundary line is calculated from the circuit part center line data and the circuit width data.

The minimum value of the non-circuit part width is calculated. Adjust so that the laser spot diameter is less than the minimum non-circuit width. An offset amount corresponding to the radius of the laser spot diameter is calculated. A laser irradiation center line offset from the circuit / non-circuit boundary line to the non-circuit portion is calculated.

The irradiation order is determined so that the laser stop period is minimized (the total movement length of irradiation positions from the continuous contour line to be irradiated to another contour line without laser irradiation is minimized). To do. The data of and are input to the galvanometer mirror control device to perform laser scanning. The above is shown as a flowchart in FIG.

In the fourteenth embodiment, C of the circuit pattern formed on the surface of the substrate is used as the irradiation control data of the electromagnetic wave beam.
Since the AD information is used, the necessary irradiation position and spot diameter (irradiation width) can be quickly determined, and the overall processing time can be shortened. -Example 15-In Example 15, a circuit board is obtained by performing selective plating by using a base material whose base material is a laser-transmissive material.

The surface of the insulating base material that transmits a YAG laser such as polyetherimide is roughened by plasma treatment. The metal film of Cu or the like is formed to a thickness of 0.1 to 2 μm on the surface of the base material by sputtering or the like. After plasma treatment,
It is desirable to form the metal film without exposing it to the atmosphere.

A laser (for example, a Q-switch YAG laser) beam is applied to a non-plating area on the surface of the insulating base material as shown in FIG.
Irradiation is performed in the same manner as in each of Examples 1 to 14 described above, as shown in 1 (a). The energy of this laser beam irradiation is set to 50 to 500 μJ / pulse. You may carry out so that the surface of the plating unnecessary area part of an insulating base material may be shaved off with a metal film. The metal film in the plating unnecessary area is removed by the laser beam irradiation, and the metal film remains only in the plating required area of the circuit pattern.

Electroplating is performed using the remaining metal film as a cathode, or electroless plating is performed to obtain a circuit board. It is easier to control the conditions because the base material is not damaged even if a slightly larger laser beam is irradiated than when the metal film or the like is removed. Alternatively, the circuit board may be obtained as follows.

Roughening and metal film formation are performed in the same manner as above. A non-plating area of the insulating base material is irradiated with a laser (for example, a Q-switch YAG laser) beam from the back surface of the base material in the same manner as in each of Examples 1 to 14 as shown in FIG. . The energy of this laser beam irradiation is
50 to 500 μJ / pulse. You may carry out so that the surface of the plating unnecessary area part of an insulating base material may be shaved off with a metal film. The metal film in the plating unnecessary area is removed by the laser beam irradiation, and the metal film remains only in the plating required area of the circuit pattern.

In addition to the ease of controlling the conditions, scattered matter from the substrate adheres to the optical system such as the lens of the laser,
The incident energy does not change due to the scattered matter obstructing the optical path. A circuit board is obtained in the same manner as above. Furthermore, you may obtain a circuit board as follows.

Roughening and metal film formation are performed in the same manner as above. Two or more insulating base materials are aligned and stacked,
A laser (for example, a Q-switch YAG laser) beam is applied to the non-plating area from the back surface of the base material in the same manner as in each of Examples 1 to 14 as shown in FIG.
The energy of this laser beam irradiation is 50 to 500 μ.
J / pulse. You may carry out so that the surface of the plating unnecessary area part of an insulating base material may be shaved off with a metal film. The metal film in the plating unnecessary area is removed by the laser beam irradiation, and the metal film remains only in the plating required area of the circuit pattern.

In addition to the ease of condition control and the problem of scattered objects, it is possible to process a plurality of sheets at the same time. A circuit board is obtained in the same manner as above. In the case of the fifteenth embodiment, it becomes possible to relax the irradiation conditions, solve the problem of scattered objects, and simultaneously process a plurality of sheets.

Example 16 In Example 16, a circuit pattern is formed on the surface of a three-dimensional base material by the selective plating method used in any of Examples 1 to 15 to obtain a circuit board. A three-dimensional surface of an insulating base material such as polyimide, ABS, polyetherimide, liquid crystal polymer, or alumina ceramics is subjected to plasma treatment for roughening.

Cu on the surface of the substrate by sputtering or the like,
A metal film of Ni, Pd, Cr, Ag, or the like is formed to a thickness of 0.1 to 2 μm to form a metal film for a plating base. Then, as shown in FIG. 22, the substrate 1 is placed on an XY table, and a laser (for example, Q-switch YAG laser) beam is emitted along or inside the contour line of the plating-free region on the surface of the positioned three-dimensional substrate. For example, irradiation is performed through a galvano mirror (or polygon mirror) to scan the surface of the base material 1. In the range that cannot be seen from the viewpoint of the galvanometer mirror, the base material is moved so as to be in the visual field range on the XY table, and the laser beam is similarly irradiated.

The laser power is, for example, 10 to 300 μm.
J / pulse. Further, a part of the base material may be shaved at the same time as the metal film. The metal film in the plating unnecessary area is removed by the laser beam irradiation, and the metal film remains only in the plating required area of the circuit pattern. A three-dimensional circuit board can be obtained by selectively performing electroplating using the remaining metal film as a cathode.

The circuit board can be obtained as follows. Similar to the above, roughening and metal film formation are performed. Then, as shown in FIG. 23, a laser (for example, Q-switch YAG laser) beam is emitted along or along the contour line of the plating-free area on the surface of the positioned three-dimensional base material,
For example, irradiation is performed through a galvano mirror (or polygon mirror), and a range visible from the viewpoint of the galvano mirror and a range visible through the Z mirror are scanned.

The laser power is, for example, 10 to 300 μm.
J / pulse. Further, a part of the base material may be shaved at the same time as the metal film. The metal film in the plating unnecessary area is removed by the laser beam irradiation, and the metal film remains only in the plating required area of the circuit pattern. If electroplating is performed in the same manner as above, a three-dimensional circuit board can be obtained. Further, the circuit board can be obtained as follows.

Roughening and metal film formation are performed in the same manner as above. Then, as shown in FIG. 24, a laser (for example, a Q switch YAG laser) beam is split by a half mirror along or inside the contour line of the plating-free area on the surface of the positioned three-dimensional base material 1, and Irradiate through the 1 (left side) galvanometer mirror (or polygon mirror), scan the range visible from the viewpoint of the first galvanometer mirror, and scan the range not visible from the viewpoint of the first galvanometer mirror.
Irradiation and scanning are performed through a second (right) galvanometer mirror (or polygon mirror) located at a view point in this range. Irradiation by the second galvano-mirror may be performed after irradiation by the first galvano-mirror.
It is also possible to obtain two beams with a single laser oscillator or beam splitter and perform irradiation with the first galvanometer mirror and irradiation with the second galvanometer mirror at the same time.

The laser power is, for example, 10 to 300 μm.
J / pulse. Further, a part of the base material may be shaved at the same time as the metal film. The metal film in the plating unnecessary area is removed by the laser beam irradiation, and the metal film remains only in the plating required area of the circuit pattern. If electroplating is performed in the same manner as above, a three-dimensional circuit board can be obtained. In addition to the above, the circuit board can be obtained as follows.

Roughening and metal film formation are performed in the same manner as above. Then, as shown in FIG. 25, a laser (for example, a Q switch YAG laser) beam is emitted along an XY galvanometer mirror (or a polygon mirror) along or inside a contour line of an unnecessary plating area on the surface of the positioned three-dimensional base material 1. ) And scan the range visible from the viewpoint of the XY galvanometer mirror and the range visible via the Z mirror.

The laser power is, for example, 10 to 300 μm.
J / pulse. Further, a part of the base material may be shaved at the same time as the metal film. By this laser beam irradiation, the metal film in the plating unnecessary area is removed, and the metal film remains only in the plating area of the circuit pattern. At this time, the laser beam is focused by using a lens having a focus lens which is equal to or larger than the step in the pattern formation area. For example, if the step difference is about ± 5 mm, a lens having a focal length of about 300 mm may be used, but if the step difference is about ± 10 mm, the focal length is about 600 mm.
Use a mm lens. Here, the depth of focus means a permissible width of deviation from the focal length of the substrate surface and the lens, and within the permissible width, the metal film is appropriately removed. In the case of the present invention, as one aspect of the third mode for controlling the irradiation width of the electromagnetic wave beam according to the uneven shape of the base material surface, as in this embodiment, a lens suitable for the three-dimensional shape of the base material surface is selected. Morphology is included.

If electroplating is performed in the same manner as above, a three-dimensional circuit board can be obtained. In Example 16, a three-dimensional circuit board can be obtained without using a resist mask.

[0105]

EFFECTS OF THE INVENTION If the width of the electromagnetic beam for irradiating the non-plating area is changed according to the pattern thickness or thinness by changing the beam spot shape or the moving speed, the width of the irradiation beam is controlled so that the thick portion takes longer time than necessary. It can be processed quickly without the need.
The irradiation width is measured during or immediately after the irradiation of the electromagnetic wave beam to the plating-free area, and if the irradiation width of the electromagnetic wave beam is controlled based on this measurement result, the width of the irradiation beam is always kept at the desired value. The plating pattern is accurate.

When the irradiation width of the electromagnetic wave beam for irradiating the non-plating area is controlled according to the uneven shape of the substrate surface, the width of the irradiation beam is maintained at a desired value, so that the plating pattern is accurate. When a laser beam with a sharp energy distribution periphery and a sharp boundary is used as an electromagnetic wave beam for irradiating the non-plating area, the boundary between the plated area and the non-plated area after plating is clear and the finishing accuracy is improved.

The electromagnetic wave beam for irradiating the plating unnecessary area is
When the surface of the base material is irradiated through a beam shaping mask that shields the edges of the electromagnetic wave, the boundary between the plated area and the non-plated area after the plating is complete and the finishing accuracy is improved. If the spot shape of the electromagnetic wave beam that irradiates the non-plating area is square, oblong, or oval, the boundary between the plated and non-plated areas after plating is clear and the finishing accuracy is improved. High-speed processing can be performed when moving the laser beam in the direction of the long side of the spot shape.

When the relative vibration is superimposed on the relative movement of the electromagnetic wave beam irradiating the non-plating area and the base material, the boundary between the plated area and the non-plated area after the plating is completed is clear and the finishing accuracy is improved. Moreover, an irradiation pattern thicker than that of the spot system can be drawn by one scanning. A sharp-pointed metal that can be used for surge arresters for circuit protection, by making pulse spots (intermittently) irradiate the non-plating area in a pulse direction so that adjacent beam spots in the movement direction partially overlap each other on their outer circumferences. It can be formed by the facing structure of the membrane.

Electromagnetic beams for irradiating the non-plating area in a pulse shape (intermittently) are arranged such that beam spots adjacent to each other in the moving direction partially overlap each other on their outer circumferences, and the beam between adjacent columns is separated. If the spots are intermittently moved such that the movement pitches of the spots are shifted from each other by about 1/2 pitch, the facing distance of the pointed portions of the metal film becomes longer, discharge is less likely to occur, and insulation deterioration is suppressed.

When a base material in which only the required plating area is selectively roughened is used as the base material, a plating film is not formed in the unnecessary plating area, and the required plating area is a roughened surface. The plating film is firmly attached. If a part of the base material is also scraped off when the laser beam is applied to the non-plating area, it is ensured that a plating film is not formed in the non-plating area.

When the electromagnetic wave beam is applied in the state where the layer having a high electromagnetic wave absorptivity is formed on the surface of the base material, the removal of the catalyst, the deactivation, and the removal of the metal can be surely performed even with the laser beam of low energy. Pd, Ag, Au,
Cu, Ni, Cr and elements that lower the thermal conductivity and /
Or using an alloy with an element having a low melting point and a high vapor pressure,
When the plating catalyst function imparting process or the metal film forming process is performed, the catalyst layer and the metal film are easily removed, so that it is possible to reliably remove the catalyst, deactivate it, or remove the metal film even with a low-energy laser beam. become.

As the irradiation control data of the electromagnetic beam,
By using the CAD information of the circuit pattern formed on the surface of the base material, the irradiation position and spot diameter (irradiation width) of the CAD information can be quickly determined. When a base material made of a laser-transmissive material is used, it is possible to easily control the laser beam irradiation conditions, solve the problem of scattered matter, and simultaneously process a plurality of sheets.

A three-dimensional circuit board can be obtained by plating the surface of a three-dimensional base material by the selective plating method of the present invention.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of control of a laser beam irradiation width by adjusting a defocus amount.

FIG. 2 is an explanatory diagram of control of a laser beam irradiation width by adjusting energy intensity.

FIG. 3 is an explanatory diagram of control of an irradiation width of a laser beam by adjusting a moving speed.

FIG. 4 is an explanatory diagram showing laser beam irradiation on a substrate surface in Example 1.

FIG. 5 is an explanatory diagram showing laser beam irradiation on a substrate surface in Example 2.

FIG. 6 is an explanatory diagram showing laser beam irradiation on the substrate surface in Example 3.

FIG. 7 is an explanatory diagram of Z position calculation on the substrate surface in the third embodiment.

FIG. 8 is an explanatory diagram of a laser beam mode according to the fourth embodiment.

FIG. 9 is an explanatory diagram showing an annular laser beam used in a fourth embodiment.

FIG. 10 is an explanatory diagram showing laser beam irradiation on a substrate surface in Example 5.

FIG. 11 is an explanatory diagram showing another laser beam irradiation on the substrate surface in the fifth embodiment.

FIG. 12 is an explanatory diagram showing a laser beam irradiation trajectory in the sixth embodiment.

FIG. 13 is an explanatory diagram showing a laser beam irradiation trajectory in the seventh embodiment.

FIG. 14 is an explanatory diagram showing a circuit pattern according to an eighth embodiment.

FIG. 15 is an explanatory diagram showing a circuit pattern according to a ninth embodiment.

FIG. 16 is an explanatory diagram showing a circuit board manufacturing process according to the tenth embodiment.

FIG. 17 is an explanatory diagram showing a circuit board manufacturing process in Example 11.

FIG. 18 is an explanatory diagram showing a circuit board manufacturing process according to a twelfth embodiment.

FIG. 19 is an explanatory diagram showing a laser beam irradiation process in Example 13.

FIG. 20 is a flowchart showing an irradiation control data determination process in the fourteenth embodiment.

21 is an explanatory diagram showing laser beam irradiation on a substrate in Example 15. FIG.

FIG. 22 is an explanatory diagram showing laser beam irradiation on the substrate surface in Example 16.

FIG. 23 is an explanatory diagram showing laser beam irradiation to another substrate surface in Example 16.

FIG. 24 is an explanatory diagram showing laser beam irradiation to another substrate surface in Example 16.

FIG. 25 is an explanatory diagram showing laser beam irradiation to another substrate surface in Example 16.

[Explanation of symbols]

 1 Insulating substrate 5 Circuit pattern 6 Thin beam 7 Thick beam

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshiyuki Uchino, 1048 Kadoma, Kadoma, Osaka Prefecture, Matsushita Electric Works Co., Ltd. (72) Keiji Nakajima, 1048, Kadoma, Kadoma City, Osaka, Matsuda Electric Works (72) Inventor Toshiyuki Suzuki, 1048, Kadoma, Kadoma, Osaka Prefecture, Matsushita Electric Works Co., Ltd. (72) Hiroaki Kitamura, 1048, Kadoma, Kadoma City, Osaka, Matsushita Electric Works, Ltd.

Claims (16)

[Claims] 1. A plating in an unplated area by irradiating an electromagnetic wave beam onto the unplated area on the substrate surface after performing a treatment for imparting a plating catalyst function or a treatment for forming a metal film on the substrate surface. In the selective plating method of selectively eliminating the catalytic function or the metal film, and then selectively forming a plating film on the plating-required area on the surface of the base material which has not been irradiated with the electromagnetic wave beam, in the relative plating of the base material and the electromagnetic wave beam, Of the irradiation position of the electromagnetic wave beam on the unnecessary plating area by moving the electromagnetic wave and controlling the irradiation width of the electromagnetic wave beam by changing at least one of the spot shape and the moving speed of the electromagnetic wave beam. Selective plating method characterized by. 2. Plating in an unnecessary plating area by irradiating an electromagnetic wave beam onto the unnecessary plating area on the surface of the base material after the surface of the base material is subjected to a treatment for imparting a plating catalyst function or a treatment for forming a metal film. In the selective plating method of selectively eliminating the catalytic function or the metal film, and then selectively forming a plating film on the plating-required area on the surface of the base material which has not been irradiated with the electromagnetic wave beam, in the relative plating of the base material and the electromagnetic wave beam, The moving position of the electromagnetic wave beam on the plating unnecessary area is moved by the automatic movement, and the irradiation width of the electromagnetic wave beam on the substrate surface is measured during or immediately after the irradiation, and the electromagnetic wave beam is irradiated based on this measurement result. A selective plating method characterized by controlling the width. 3. A plating in an unnecessary plating area by irradiating an electromagnetic wave beam onto the unnecessary plating area on the surface of the base material after performing a treatment for imparting a plating catalyst function or a treatment for forming a metal film to the surface of the base material. In the selective plating method of selectively eliminating the catalytic function or the metal film, and then selectively forming a plating film on the plating-required area on the surface of the base material which has not been irradiated with the electromagnetic wave beam, in the relative plating of the base material and the electromagnetic wave beam, Selective plating characterized in that the irradiation position of the electromagnetic wave beam is moved on the unnecessary plating area by the automatic movement, and the base material surface is uneven, and the irradiation width of the electromagnetic wave beam is controlled according to this uneven shape. Method. 4. The plating of the non-plating area is performed by irradiating an electromagnetic wave beam on the non-plating area of the base material surface after a treatment of imparting a plating catalyst function to the surface of the base material or a treatment of forming a metal film. In the selective plating method, in which the catalytic function or the metal film is selectively eliminated, and then the plating film is selectively formed on the plating-required area on the surface of the base material that has not been irradiated with the electromagnetic wave, The selective plating method is characterized in that the irradiation position of the electromagnetic wave beam is moved on the non-plating unnecessary area by a mechanical movement and a laser beam of a beam mode having a sharp energy distribution periphery is used as the electromagnetic wave beam. 5. A plating in an unnecessary plating area is performed by irradiating an electromagnetic wave beam onto the unnecessary plating area on the surface of the base material after performing a treatment for imparting a plating catalyst function or a treatment for forming a metal film on the surface of the base material. In the selective plating method of selectively eliminating the catalytic function or the metal film, and then selectively forming a plating film on the plating-required area on the surface of the base material which has not been irradiated with the electromagnetic wave beam, in the relative plating of the base material and the electromagnetic wave beam, The selective plating method is characterized in that the irradiation position of the electromagnetic beam on the unnecessary plating area is moved by a specific movement, and the electromagnetic beam is irradiated through a beam shaping mask that shields the edges of the electromagnetic beam. 6. A plating in an unnecessary plating area by irradiating an electromagnetic wave beam onto the unnecessary plating area on the surface of the base material after performing a treatment for imparting a plating catalyst function or a treatment for forming a metal film to the surface of the base material. In the selective plating method of selectively eliminating the catalytic function or the metal film, and then selectively forming a plating film on the plating-required area on the surface of the base material which has not been irradiated with the electromagnetic wave beam, in the relative plating of the base material and the electromagnetic wave beam, The selective plating is characterized in that the irradiation position of the electromagnetic wave beam is moved on the unnecessary plating area by a mechanical movement and the spot shape of the electromagnetic wave beam is any one of a square shape, an oblong shape and an oval shape. Method. 7. A plating in an unnecessary plating area is performed by irradiating an electromagnetic wave beam onto the unnecessary plating area on the surface of the base material after the surface of the base material is subjected to a treatment for imparting a plating catalyst function or a treatment for forming a metal film. In the selective plating method, in which the catalytic function or the metal film is selectively eliminated, and then the plating film is selectively formed on the plating-required area on the surface of the base material that has not been irradiated with the electromagnetic wave, The selective plating method is characterized in that the irradiation position of the electromagnetic wave beam is moved on the unnecessary plating area by a specific movement, and relative vibration is superimposed on the relative movement of the base material and the electromagnetic wave beam. 8. A plating in an unplated area by irradiating an electromagnetic wave beam on the unplated area on the substrate surface after performing a treatment for imparting a plating catalyst function or a treatment for forming a metal film on the substrate surface. In the selective plating method, in which the catalytic function or the metal film is selectively eliminated, and then the plating film is selectively formed on the plating-required area on the surface of the base material that has not been irradiated with the electromagnetic wave, The moving position of the electromagnetic wave beam on the plating unnecessary area is moved by a mechanical movement, and the irradiation of the electromagnetic wave beam is performed in a pulse shape so that adjacent beam spots in the moving direction partially overlap each other on their outer circumferences. A selective plating method characterized by: 9. A plating in an unnecessary plating area by irradiating an electromagnetic wave beam on the unnecessary plating area on the surface of the base material after performing a treatment for imparting a plating catalyst function or a treatment for forming a metal film on the surface of the base material. In the selective plating method, in which the catalytic function or the metal film is selectively eliminated, and then the plating film is selectively formed on the plating-required area on the surface of the base material that has not been irradiated with the electromagnetic wave, By moving the electromagnetic wave irradiation position on the plating-free area, the irradiation of the electromagnetic wave beam,
It is performed in a pulse shape so that adjacent beam spots in the moving direction partially overlap each other on their outer circumferences, and the intermittent movement of the beam spots between adjacent columns is about 1/2 pitch. A selective plating method characterized in that they are performed so that they are offset from each other. 10. The selective plating method according to claim 1, wherein a base material in which only a plating required area is selectively roughened is used as the base material. 11. The selective plating method according to claim 1, wherein a part of the base material is simultaneously removed by irradiation with an electromagnetic wave beam. 12. The selective plating method according to claim 1, wherein the base material has a layer having a high absorption rate for an electromagnetic wave beam on the surface thereof. 13. The process of imparting a plating catalyst function or the process of forming a metal film is performed by using Pd, Ag, Au, Cu, N.
The selective plating method according to any one of claims 1 to 11, which is carried out using an alloy of i, Cr and an element that lowers thermal conductivity and / or an element that has a low melting point and a high vapor pressure. 14. The selective plating method according to claim 1, wherein CAD information of a circuit pattern formed on the surface of the substrate is used as the irradiation control data of the electromagnetic wave beam. 15. The selective plating method according to claim 1, wherein the base material is a base material made of a laser transmissive material. 16. A method of manufacturing a circuit board, which comprises forming a plating film having a predetermined circuit pattern on the surface of a three-dimensional base material by the selective plating method according to claim 1.