JPS63115072U - - Google Patents
Info
- Publication number
- JPS63115072U JPS63115072U JP454987U JP454987U JPS63115072U JP S63115072 U JPS63115072 U JP S63115072U JP 454987 U JP454987 U JP 454987U JP 454987 U JP454987 U JP 454987U JP S63115072 U JPS63115072 U JP S63115072U
- Authority
- JP
- Japan
- Prior art keywords
- plating tank
- treated
- horizontal
- slit
- horizontal plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 238000007872 degassing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
第１図ないし第３図は本考案の一実施例を説明
するために示したもので、第１図は装置全体の構
成を示す側断面図、第２図は被処理材、ダムロー
ルおよびワイパ相互の関係を示す図、第３図は第
１図のワイパ機構の一部を示す図、第４図はスリ
ツトの他の例を説明する図、第５図および第６図
はそれぞれ本考案の他の実施例を示す側断面図で
ある。
１１……被処理材、１２……横型メツキ槽、１
３，１４……搬送ロール、１５，１５′，１６，
１６′……ダムロール、１７……電解液、１９…
…ワイパ機構、２０……電極、２１……外槽、２
２……ポンプ、２３……噴出ノズル、２４……ス
リツト。
1 to 3 are shown to explain one embodiment of the present invention. FIG. 1 is a side sectional view showing the overall structure of the device, and FIG. FIG. 3 is a diagram showing a part of the wiper mechanism in FIG. 1, FIG. 4 is a diagram explaining another example of the slit, and FIGS. It is a side sectional view showing an example of this. 11... Material to be treated, 12... Horizontal plating tank, 1
3, 14... Conveyance roll, 15, 15', 16,
16'...dumb roll, 17...electrolyte, 19...
... Wiper mechanism, 20 ... Electrode, 21 ... Outer tank, 2
2... pump, 23... jet nozzle, 24... slit.
Claims (1)
材表面にメツキ処理を施す電気メツキ装置におい
て、前記横型メツキ槽での被処理材の入側および
出側のうち少なくとも出側に配置されたダムロー
ルにスリツトを形成し、電気メツキ処理時に生じ
る水素ガスの気泡を前記スリツトを介して横型メ
ツキ槽外へ流出させることによりメツキムラを防
止することを特徴とする横型メツキ槽のガス抜き
装置。 In an electroplating device that passes a material to be treated through a horizontal plating tank and applies plating to the surface of the material to be treated, a dam roll disposed at least on an inlet side and an outlet side of the material to be treated in the horizontal plating tank is provided. 1. A degassing device for a horizontal plating tank, characterized in that a slit is formed and hydrogen gas bubbles generated during electroplating are caused to flow out of the horizontal plating tank through the slit to prevent plating unevenness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP454987U JPS63115072U (en) | 1987-01-16 | 1987-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP454987U JPS63115072U (en) | 1987-01-16 | 1987-01-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63115072U true JPS63115072U (en) | 1988-07-25 |
Family
ID=30785311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP454987U Pending JPS63115072U (en) | 1987-01-16 | 1987-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63115072U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0426794A (en) * | 1990-05-22 | 1992-01-29 | Nkk Corp | Horizontal electroplating device |
-
1987
- 1987-01-16 JP JP454987U patent/JPS63115072U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0426794A (en) * | 1990-05-22 | 1992-01-29 | Nkk Corp | Horizontal electroplating device |