JPH0334064U - - Google Patents
Info
- Publication number
- JPH0334064U JPH0334064U JP9178389U JP9178389U JPH0334064U JP H0334064 U JPH0334064 U JP H0334064U JP 9178389 U JP9178389 U JP 9178389U JP 9178389 U JP9178389 U JP 9178389U JP H0334064 U JPH0334064 U JP H0334064U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- cup
- jet
- plating device
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Coating Apparatus (AREA)
Description
第１図ａは本考案の実施例１を示す平面図、ｂ
は同縦断面図、第２図ａは本考案の実施例２を示
す平面図、ｂは同部分縦断面図である。
１０１，２０１……噴流カツプ、１０２，２０
２……第一の整流板、１０３，２０３……第二の
整流板、１０４，２０４……第三の整流板、２０
５……第四の整流板、２０６……第五の整流板、
２０７……第六の整流板、２０８……メツキ液流
。
FIG. 1a is a plan view showing Embodiment 1 of the present invention, b
FIG. 2A is a plan view showing a second embodiment of the present invention, and FIG. 2B is a partial longitudinal sectional view thereof. 101,201...jet cup, 102,20
2...First current plate, 103,203...Second current plate, 104,204...Third current plate, 20
5...Fourth rectifier plate, 206...Fifth rectifier plate,
207...Sixth current plate, 208...Metsuki liquid flow.
Claims (1)
キ装置において、噴流カツプ内に、該カツプ内で
のメツキ液の流速分布を制御する多孔性整流板を
有することを特徴とするメツキ装置。 1. A jet plating device for forming a plating film on a semiconductor substrate, the plating device comprising a porous rectifier plate in a jet cup for controlling the flow velocity distribution of plating liquid within the cup.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9178389U JPH0334064U (en) | 1989-08-03 | 1989-08-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9178389U JPH0334064U (en) | 1989-08-03 | 1989-08-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0334064U true JPH0334064U (en) | 1991-04-03 |
Family
ID=31641248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9178389U Pending JPH0334064U (en) | 1989-08-03 | 1989-08-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334064U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002220690A (en) * | 2001-01-29 | 2002-08-09 | Dowa Mining Co Ltd | Electroplating method and electroplating apparatus |
| JP2014051697A (en) * | 2012-09-05 | 2014-03-20 | Mitomo Semicon Engineering Kk | Cup type plating apparatus and plating method using the same |
| JP2014189811A (en) * | 2013-03-26 | 2014-10-06 | Kyocera Corp | Electroless plating apparatus |
-
1989
- 1989-08-03 JP JP9178389U patent/JPH0334064U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002220690A (en) * | 2001-01-29 | 2002-08-09 | Dowa Mining Co Ltd | Electroplating method and electroplating apparatus |
| JP4677675B2 (en) * | 2001-01-29 | 2011-04-27 | Ｄｏｗａメタルテック株式会社 | Electroplating method and apparatus |
| JP2014051697A (en) * | 2012-09-05 | 2014-03-20 | Mitomo Semicon Engineering Kk | Cup type plating apparatus and plating method using the same |
| JP2014189811A (en) * | 2013-03-26 | 2014-10-06 | Kyocera Corp | Electroless plating apparatus |