JPS62101230U - - Google Patents
Info
- Publication number
- JPS62101230U JPS62101230U JP19323785U JP19323785U JPS62101230U JP S62101230 U JPS62101230 U JP S62101230U JP 19323785 U JP19323785 U JP 19323785U JP 19323785 U JP19323785 U JP 19323785U JP S62101230 U JPS62101230 U JP S62101230U
- Authority
- JP
- Japan
- Prior art keywords
- fixed position
- inner cup
- chuck
- semiconductor wafer
- cup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
Description
第１図及び第２図は本考案に係る塗布装置の一
実施例を示す各動作状態での側断面図、第３図及
び第４図はそれぞれ第１図及び第２図における内
カツプとノズルの部分斜視図である。第５図及び
第６図は従来の塗布装置の各動作状態での側断面
図である。
１…半導体ウエーハ、７…塗布液〔フオトレジ
スト材〕、８…チヤツク、９…内カツプ、１０…
切欠き、１１…外カツプ、１３…ノズル。
1 and 2 are side sectional views showing one embodiment of the coating device according to the present invention in various operating states, and FIGS. 3 and 4 show the inner cup and nozzle in FIGS. 1 and 2, respectively. FIG. 5 and 6 are side sectional views of a conventional coating device in various operating states. DESCRIPTION OF SYMBOLS 1...Semiconductor wafer, 7...Coating liquid [photoresist material], 8...Chick, 9...Inner cup, 10...
Notch, 11...outer cup, 13...nozzle.
Claims (1)
クの側方及び下方を囲い、側壁の上端部に切欠き
を有する内カツプと、内カツプの側方と下方を囲
う外カツプと、チヤツク上の半導体ウエーハの中
央部上方定位置及び内カツプと外カツプの間の定
位置間を内カツプの切欠きを通り往復移動して、
前者定位置で半導体ウエーハ上に塗布液を供給し
、後者定位置で洗浄処理されるノズルとを具備し
たことを特徴とする塗布装置。 A chuck for adsorbing a semiconductor wafer, an inner cup that surrounds the sides and bottom of the chuck and has a notch at the upper end of the side wall, an outer cup that surrounds the sides and bottom of the inner cup, and the center of the semiconductor wafer on the chuck. reciprocally move between the upper fixed position and the fixed position between the inner cup and the outer cup through the notch of the inner cup,
A coating device comprising: a nozzle that supplies a coating liquid onto a semiconductor wafer at the former fixed position, and a nozzle that is cleaned at the latter fixed position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19323785U JPS62101230U (en) | 1985-12-16 | 1985-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19323785U JPS62101230U (en) | 1985-12-16 | 1985-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62101230U true JPS62101230U (en) | 1987-06-27 |
Family
ID=31149073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19323785U Pending JPS62101230U (en) | 1985-12-16 | 1985-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62101230U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013093361A (en) * | 2011-10-24 | 2013-05-16 | Tokyo Electron Ltd | Liquid processing apparatus and liquid processing method |
| JP2018133429A (en) * | 2017-02-15 | 2018-08-23 | 東京エレクトロン株式会社 | Substrate processing device |
-
1985
- 1985-12-16 JP JP19323785U patent/JPS62101230U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013093361A (en) * | 2011-10-24 | 2013-05-16 | Tokyo Electron Ltd | Liquid processing apparatus and liquid processing method |
| JP2018133429A (en) * | 2017-02-15 | 2018-08-23 | 東京エレクトロン株式会社 | Substrate processing device |