JPH0327040U - - Google Patents
Info
- Publication number
- JPH0327040U JPH0327040U JP8778489U JP8778489U JPH0327040U JP H0327040 U JPH0327040 U JP H0327040U JP 8778489 U JP8778489 U JP 8778489U JP 8778489 U JP8778489 U JP 8778489U JP H0327040 U JPH0327040 U JP H0327040U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- solid body
- nozzle
- semiconductor
- ejects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007787 solid Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 description 1
Description
第１図はこの考案の第１実施例の装置要部の側
面図、第２図は固形体部分の拡大図である。第３
図は第２実施例の固形体部分の拡大図である。第
４図は従来装置の装置要部の側面図である。
１……ウエーハ、２……突起物、３……固形物
、３ａ……ノズル、４……液体、５……ウエーハ
吸着台。
FIG. 1 is a side view of the main parts of a device according to a first embodiment of this invention, and FIG. 2 is an enlarged view of the solid portion. Third
The figure is an enlarged view of the solid portion of the second embodiment. FIG. 4 is a side view of the main parts of the conventional device. 1...Wafer, 2...Protrusion, 3...Solid object, 3a...Nozzle, 4...Liquid, 5...Wafer adsorption stand.
Claims (1)
、ウエーハ上に浮上させた固形体を水平方向から
衝突させることにより切削除去する装置において
、固形体のウエーハ対向部に液体を噴出させるノ
ズルを設けたことを特徴とする半導体装置製造装
置。 A device that cuts and removes protrusions that have formed on a semiconductor wafer by horizontally colliding a solid body suspended above the wafer, which is equipped with a nozzle that ejects a liquid onto the part of the solid body facing the wafer. A semiconductor device manufacturing apparatus characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8778489U JPH0327040U (en) | 1989-07-26 | 1989-07-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8778489U JPH0327040U (en) | 1989-07-26 | 1989-07-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0327040U true JPH0327040U (en) | 1991-03-19 |
Family
ID=31637424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8778489U Pending JPH0327040U (en) | 1989-07-26 | 1989-07-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0327040U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002014617A (en) * | 2000-06-29 | 2002-01-18 | Sato Corp | Tag |
-
1989
- 1989-07-26 JP JP8778489U patent/JPH0327040U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002014617A (en) * | 2000-06-29 | 2002-01-18 | Sato Corp | Tag |