JPS639129U - - Google Patents
Info
- Publication number
- JPS639129U JPS639129U JP10137786U JP10137786U JPS639129U JP S639129 U JPS639129 U JP S639129U JP 10137786 U JP10137786 U JP 10137786U JP 10137786 U JP10137786 U JP 10137786U JP S639129 U JPS639129 U JP S639129U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- resist
- spinner head
- center
- coating apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Manufacturing Optical Record Carriers (AREA)
Description
第１図はこの考案の一実施例の装置でコーテイ
ングを行つた状態を示す断面図、第２図はこの考
案の一実施例の装置を示す断面図、第３図は従来
の装置を示す断面図、第４図は中心に歪吸収用穴
を有する半導体ウエハを示す平面図である。
１……スピナーカツプ、２……半導体ウエハ、
３……スピナーヘツド、４……モータ、５……レ
ジスト、６……ノズル、７……歪吸収用穴、８…
…突部。
Fig. 1 is a sectional view showing a coating state using an apparatus according to an embodiment of this invention, Fig. 2 is a sectional view showing an apparatus according to an embodiment of this invention, and Fig. 3 is a sectional view showing a conventional apparatus. 4 are plan views showing a semiconductor wafer having a strain absorbing hole in the center. 1... Spinner cup, 2... Semiconductor wafer,
3... Spinner head, 4... Motor, 5... Resist, 6... Nozzle, 7... Strain absorption hole, 8...
...projection.
Claims (1)
体ウエハを吸着保持し、その半導体ウエハ面にノ
ズルよりレジストを滴下させると同時に、前記ス
ピナーヘツドにより半導体ウエハを回転させるこ
とにより、前記レジストを半導体ウエハ上の全面
に塗布するようにした半導体ウエハのレジストコ
ーテイング装置において、 中心に歪吸収用穴を有する半導体ウエハの前記
歪吸収用穴に嵌合される先端円錐状の突部を前記
スピナーヘツドの中心に設け、 この突部の真上に前記レジスト滴下用のノズル
が位置することを特徴とする半導体ウエハのレジ
ストコーテイング装置。[Claims for Utility Model Registration] A semiconductor wafer is suctioned and held on a spinner head at the center of a cup-shaped envelope, and resist is dropped from a nozzle onto the surface of the semiconductor wafer, and at the same time, the semiconductor wafer is rotated by the spinner head. According to the present invention, there is provided a resist coating apparatus for a semiconductor wafer, which coats the resist on the entire surface of the semiconductor wafer. A resist coating apparatus for a semiconductor wafer, characterized in that a part is provided at the center of the spinner head, and the resist dripping nozzle is located directly above the protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10137786U JPS639129U (en) | 1986-07-03 | 1986-07-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10137786U JPS639129U (en) | 1986-07-03 | 1986-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS639129U true JPS639129U (en) | 1988-01-21 |
Family
ID=30972054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10137786U Pending JPS639129U (en) | 1986-07-03 | 1986-07-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS639129U (en) |
-
1986
- 1986-07-03 JP JP10137786U patent/JPS639129U/ja active Pending