JPH02146829U - - Google Patents
Info
- Publication number
- JPH02146829U JPH02146829U JP5497489U JP5497489U JPH02146829U JP H02146829 U JPH02146829 U JP H02146829U JP 5497489 U JP5497489 U JP 5497489U JP 5497489 U JP5497489 U JP 5497489U JP H02146829 U JPH02146829 U JP H02146829U
- Authority
- JP
- Japan
- Prior art keywords
- processed
- spin head
- resist coating
- coating apparatus
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 claims 1
Description
第1図はこの考案の一実施例によるレジスト塗
布装置を示す平面図、第2図はこの考案の断面図
、第3図は従来のレジスト塗布装置を示す平面図
、第4図は従来のレジスト塗布装置を示す断面図
である。
1……スピンヘツド、2……ウエハ、3……カ
ツプ、4……モータ、5……ストツパガイド、6
……ノズル、7……センタリングガイド、8……
押しバネ。なお、図中、同一符号は同一、又は相
当部分を示す。
FIG. 1 is a plan view showing a resist coating device according to an embodiment of this invention, FIG. 2 is a sectional view of this invention, FIG. 3 is a plan view showing a conventional resist coating device, and FIG. 4 is a plan view showing a conventional resist coating device. It is a sectional view showing a coating device. 1...Spin head, 2...Wafer, 3...Cup, 4...Motor, 5...Stopper guide, 6
... Nozzle, 7 ... Centering guide, 8 ...
Push spring. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
処理を行うレジスト塗布装置において、上記被処
理体を回転させるスピンヘツドと、前記スピンヘ
ツドの横方に配設され且つ上記被処理体の外周面
が当接する面を形成したガイドとを有し、上記ガ
イドにより、上記被処理体を上記スピンヘツド上
の定位置に位置決めすることを特徴とするレジス
ト塗布装置。 A resist coating apparatus that performs surface treatment by rotating a flat object to be processed, such as a wafer, includes a spin head for rotating the object to be processed, and a spin head disposed laterally of the spin head and whose outer peripheral surface of the object to be processed is 1. A resist coating apparatus comprising: a guide having a surface that comes into contact with the resist coating apparatus; and the guide positions the object to be processed at a predetermined position on the spin head.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5497489U JPH02146829U (en) | 1989-05-12 | 1989-05-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5497489U JPH02146829U (en) | 1989-05-12 | 1989-05-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02146829U true JPH02146829U (en) | 1990-12-13 |
Family
ID=31577517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5497489U Pending JPH02146829U (en) | 1989-05-12 | 1989-05-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02146829U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8932672B2 (en) | 2006-02-02 | 2015-01-13 | Screen Semiconductor Solutions Co., Ltd. | Substrate processing apparatus |
CN108987311A (en) * | 2017-05-31 | 2018-12-11 | 株式会社斯库林集团 | Substrate board treatment and substrate processing method using same |
-
1989
- 1989-05-12 JP JP5497489U patent/JPH02146829U/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8932672B2 (en) | 2006-02-02 | 2015-01-13 | Screen Semiconductor Solutions Co., Ltd. | Substrate processing apparatus |
US9477162B2 (en) | 2006-02-02 | 2016-10-25 | Screen Semiconductor Solutions Co., Ltd. | Substrate processing method |
CN108987311A (en) * | 2017-05-31 | 2018-12-11 | 株式会社斯库林集团 | Substrate board treatment and substrate processing method using same |
JP2018206877A (en) * | 2017-05-31 | 2018-12-27 | 株式会社Screenホールディングス | Substrate processing apparatus and substrate processing method |
CN108987311B (en) * | 2017-05-31 | 2022-03-04 | 株式会社斯库林集团 | Substrate processing apparatus and substrate processing method |