JPH02146829U - - Google Patents

Info

Publication number
JPH02146829U
JPH02146829U JP5497489U JP5497489U JPH02146829U JP H02146829 U JPH02146829 U JP H02146829U JP 5497489 U JP5497489 U JP 5497489U JP 5497489 U JP5497489 U JP 5497489U JP H02146829 U JPH02146829 U JP H02146829U
Authority
JP
Japan
Prior art keywords
processed
spin head
resist coating
coating apparatus
rotating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5497489U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5497489U priority Critical patent/JPH02146829U/ja
Publication of JPH02146829U publication Critical patent/JPH02146829U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例によるレジスト塗
布装置を示す平面図、第2図はこの考案の断面図
、第3図は従来のレジスト塗布装置を示す平面図
、第4図は従来のレジスト塗布装置を示す断面図
である。 1……スピンヘツド、2……ウエハ、3……カ
ツプ、4……モータ、5……ストツパガイド、6
……ノズル、7……センタリングガイド、8……
押しバネ。なお、図中、同一符号は同一、又は相
当部分を示す。
FIG. 1 is a plan view showing a resist coating device according to an embodiment of this invention, FIG. 2 is a sectional view of this invention, FIG. 3 is a plan view showing a conventional resist coating device, and FIG. 4 is a plan view showing a conventional resist coating device. It is a sectional view showing a coating device. 1...Spin head, 2...Wafer, 3...Cup, 4...Motor, 5...Stopper guide, 6
... Nozzle, 7 ... Centering guide, 8 ...
Push spring. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ウエハ等の平板状の被処理体を回転させて表面
処理を行うレジスト塗布装置において、上記被処
理体を回転させるスピンヘツドと、前記スピンヘ
ツドの横方に配設され且つ上記被処理体の外周面
が当接する面を形成したガイドとを有し、上記ガ
イドにより、上記被処理体を上記スピンヘツド上
の定位置に位置決めすることを特徴とするレジス
ト塗布装置。
A resist coating apparatus that performs surface treatment by rotating a flat object to be processed, such as a wafer, includes a spin head for rotating the object to be processed, and a spin head disposed laterally of the spin head and whose outer peripheral surface of the object to be processed is 1. A resist coating apparatus comprising: a guide having a surface that comes into contact with the resist coating apparatus; and the guide positions the object to be processed at a predetermined position on the spin head.
JP5497489U 1989-05-12 1989-05-12 Pending JPH02146829U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5497489U JPH02146829U (en) 1989-05-12 1989-05-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5497489U JPH02146829U (en) 1989-05-12 1989-05-12

Publications (1)

Publication Number Publication Date
JPH02146829U true JPH02146829U (en) 1990-12-13

Family

ID=31577517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5497489U Pending JPH02146829U (en) 1989-05-12 1989-05-12

Country Status (1)

Country Link
JP (1) JPH02146829U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8932672B2 (en) 2006-02-02 2015-01-13 Screen Semiconductor Solutions Co., Ltd. Substrate processing apparatus
CN108987311A (en) * 2017-05-31 2018-12-11 株式会社斯库林集团 Substrate board treatment and substrate processing method using same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8932672B2 (en) 2006-02-02 2015-01-13 Screen Semiconductor Solutions Co., Ltd. Substrate processing apparatus
US9477162B2 (en) 2006-02-02 2016-10-25 Screen Semiconductor Solutions Co., Ltd. Substrate processing method
CN108987311A (en) * 2017-05-31 2018-12-11 株式会社斯库林集团 Substrate board treatment and substrate processing method using same
JP2018206877A (en) * 2017-05-31 2018-12-27 株式会社Screenホールディングス Substrate processing apparatus and substrate processing method
CN108987311B (en) * 2017-05-31 2022-03-04 株式会社斯库林集团 Substrate processing apparatus and substrate processing method

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