JPS6329931U - - Google Patents

Info

Publication number
JPS6329931U
JPS6329931U JP12252586U JP12252586U JPS6329931U JP S6329931 U JPS6329931 U JP S6329931U JP 12252586 U JP12252586 U JP 12252586U JP 12252586 U JP12252586 U JP 12252586U JP S6329931 U JPS6329931 U JP S6329931U
Authority
JP
Japan
Prior art keywords
rotating shaft
holding part
processing surface
wafer
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12252586U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12252586U priority Critical patent/JPS6329931U/ja
Publication of JPS6329931U publication Critical patent/JPS6329931U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る一実施例の半導体製造装
置の正断面図、第2図は第1図の平面図である。
第3図は従来の半導体製造装置の正断面図、第4
図は第3図の一部拡大正面図である。 10……保持部、11……ウエーハ、10a…
…液だめ部、13……アーム、17……半導体製
造装置。
FIG. 1 is a front sectional view of a semiconductor manufacturing apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view of FIG. 1.
Figure 3 is a front cross-sectional view of conventional semiconductor manufacturing equipment;
The figure is a partially enlarged front view of FIG. 3. 10...Holding section, 11...Wafer, 10a...
...liquid reservoir, 13...arm, 17...semiconductor manufacturing equipment.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ウエーハの被処理面の外周縁を真空吸着
し、且つ、ウエーハの処理面上に所定の量の処理
液を貯溜する液だめ部を形成した保持部と、この
保持部をアームを介して一体的に支持した回転軸
とを具備したことを特徴とする半導体製造装置。
A holding part that vacuum-chucks the outer peripheral edge of the processing surface of a semiconductor wafer and forms a liquid reservoir for storing a predetermined amount of processing liquid on the processing surface of the wafer, and this holding part is integrated via an arm. What is claimed is: 1. A semiconductor manufacturing device comprising: a rotating shaft that is supported by a rotating shaft;
JP12252586U 1986-08-08 1986-08-08 Pending JPS6329931U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12252586U JPS6329931U (en) 1986-08-08 1986-08-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12252586U JPS6329931U (en) 1986-08-08 1986-08-08

Publications (1)

Publication Number Publication Date
JPS6329931U true JPS6329931U (en) 1988-02-27

Family

ID=31012792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12252586U Pending JPS6329931U (en) 1986-08-08 1986-08-08

Country Status (1)

Country Link
JP (1) JPS6329931U (en)

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