JPH01140824U - - Google Patents
Info
- Publication number
- JPH01140824U JPH01140824U JP3653288U JP3653288U JPH01140824U JP H01140824 U JPH01140824 U JP H01140824U JP 3653288 U JP3653288 U JP 3653288U JP 3653288 U JP3653288 U JP 3653288U JP H01140824 U JPH01140824 U JP H01140824U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- holding member
- side surfaces
- rotating plate
- immersing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Description
第１図は本考案装置の一実施例を示す斜視図、
第２図は本考案装置の動作を示し、同図ａは上面
から見た動作説明図、同図ｂ及びｃは側面から見
た動作説明図、第３図は本考案装置の他の実施例
を側面から見た動作説明図、第４図は従来装置の
斜視図である。
１……回転板、２……保持部材、３……半導体
ウエハ。
FIG. 1 is a perspective view showing an embodiment of the device of the present invention;
Figure 2 shows the operation of the device of the present invention, Figure a is an explanatory diagram of the operation seen from the top, Figures b and c are explanatory diagrams of the operation seen from the side, and Figure 3 is another embodiment of the device of the present invention. FIG. 4 is a perspective view of the conventional device. 1... Rotating plate, 2... Holding member, 3... Semiconductor wafer.
Claims (1)
ウエハを処理する半導体ウエハ処理装置であつて
、半導体ウエハと、該半導体ウエハを固定する回
転板と、該回転板を回転自在に保持する保持部材
と、を備え、該保持部材は底面及び対向する一対
の側面が開口されると共に、上記回転板に固定さ
れた半導体ウエハが上記保持部材の開口した側面
で露出することを特徴とした半導体ウエハ処理装
置。 A semiconductor wafer processing apparatus that processes the semiconductor wafer by immersing the semiconductor wafer in a processing liquid, the apparatus comprising: a semiconductor wafer; a rotating plate that fixes the semiconductor wafer; and a holding member that rotatably holds the rotating plate. , wherein the holding member has an open bottom surface and a pair of opposing side surfaces, and the semiconductor wafer fixed to the rotary plate is exposed at the open side surfaces of the holding member. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3653288U JPH01140824U (en) | 1988-03-18 | 1988-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3653288U JPH01140824U (en) | 1988-03-18 | 1988-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140824U true JPH01140824U (en) | 1989-09-27 |
Family
ID=31263130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3653288U Pending JPH01140824U (en) | 1988-03-18 | 1988-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140824U (en) |
-
1988
- 1988-03-18 JP JP3653288U patent/JPH01140824U/ja active Pending