JPS62136432U - - Google Patents

Info

Publication number
JPS62136432U
JPS62136432U JP15057986U JP15057986U JPS62136432U JP S62136432 U JPS62136432 U JP S62136432U JP 15057986 U JP15057986 U JP 15057986U JP 15057986 U JP15057986 U JP 15057986U JP S62136432 U JPS62136432 U JP S62136432U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
cassette
grooves
held
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15057986U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15057986U priority Critical patent/JPS62136432U/ja
Publication of JPS62136432U publication Critical patent/JPS62136432U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Warehouses Or Storage Devices (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す断面図である
。 なお図において、1…カセツト、2,3,4,
5…テフロンストツパ、6…角形基板、7…対角
線、8…アーム、である。
FIG. 1 is a sectional view showing an embodiment of the present invention. In the figure, 1...cassette, 2, 3, 4,
5... Teflon stopper, 6... Square substrate, 7... Diagonal line, 8... Arm.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 上・下面半導体ウエハ取り出し穴が設けられた
箱状筐体の対向する二側面の各々内面に溝が設け
られ、この溝に半導体ウエハが差し込まれて保持
される半導体ウエハ保持用のカセツトと、このカ
セツト内に保持された半導体ウエハを下方から嵌
合させて上記半導体ウエハの加工部へ移送する平
板状アームとを具備してなることを特徴とする半
導体ウエハ加工装置。
A cassette for holding semiconductor wafers, in which grooves are provided on the inner surfaces of each of two opposing sides of a box-like housing having upper and lower semiconductor wafer ejection holes, and semiconductor wafers are inserted into the grooves and held; 1. A semiconductor wafer processing apparatus comprising a flat arm that fits a semiconductor wafer held in a cassette from below and transfers the semiconductor wafer to a processing section.
JP15057986U 1986-09-30 1986-09-30 Pending JPS62136432U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15057986U JPS62136432U (en) 1986-09-30 1986-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15057986U JPS62136432U (en) 1986-09-30 1986-09-30

Publications (1)

Publication Number Publication Date
JPS62136432U true JPS62136432U (en) 1987-08-27

Family

ID=31066849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15057986U Pending JPS62136432U (en) 1986-09-30 1986-09-30

Country Status (1)

Country Link
JP (1) JPS62136432U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50125462A (en) * 1974-03-20 1975-10-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50125462A (en) * 1974-03-20 1975-10-02

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