JPS6373934U - - Google Patents
Info
- Publication number
- JPS6373934U JPS6373934U JP16876886U JP16876886U JPS6373934U JP S6373934 U JPS6373934 U JP S6373934U JP 16876886 U JP16876886 U JP 16876886U JP 16876886 U JP16876886 U JP 16876886U JP S6373934 U JPS6373934 U JP S6373934U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- tests
- pellets
- prober
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000008188 pellet Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000007689 inspection Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第1図は本考案に係る半導体装置の平面図、第
2図乃至第4図は上記半導体装置の動作例を説明
するための各工程での側面図、第5図は上記半導
体装置のフローチヤート、第6図は他の実施例を
示す平面図、第7図は従来の半導体装置のフロー
チヤートである。
1……半導体ウエーハ(ウエーハ)、2……半
導体ペレツト(ペレツト)、3a,3b,12…
…ステージ部、4……アライメント機構、6……
プローバ機構、11……半導体製造装置。
FIG. 1 is a plan view of the semiconductor device according to the present invention, FIGS. 2 to 4 are side views of each process for explaining an example of the operation of the semiconductor device, and FIG. 5 is a flowchart of the semiconductor device. , FIG. 6 is a plan view showing another embodiment, and FIG. 7 is a flowchart of a conventional semiconductor device. 1... Semiconductor wafer (wafer), 2... Semiconductor pellet (pellet), 3a, 3b, 12...
... Stage section, 4 ... Alignment mechanism, 6 ...
Prober mechanism, 11... semiconductor manufacturing equipment.
Claims (1)
た半導体ウエーハの位置合せを行うアライメント
機構を有し、第2のポジシヨンに上記半導体ペレ
ツトの特性検査を行うプローバ機構を有し、上記
半導体ウエーハが載置され、第1・第2のポジシ
ヨン間で移動可能に配設されたステージ部を有し
、上記第1・第2のポジシヨンで位置出し及び特
性検査が順次並行して行われることを特徴とする
半導体製造装置。 It has an alignment mechanism that aligns the semiconductor wafer on which semiconductor pellets are formed in a first position, a prober mechanism that tests the characteristics of the semiconductor pellets in a second position, and has a prober mechanism that tests the characteristics of the semiconductor pellets on which the semiconductor wafer is placed. , a semiconductor characterized in that it has a stage section movably disposed between a first and second position, and positioning and characteristic inspection are performed in parallel in the first and second positions. Manufacturing equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16876886U JPS6373934U (en) | 1986-10-31 | 1986-10-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16876886U JPS6373934U (en) | 1986-10-31 | 1986-10-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6373934U true JPS6373934U (en) | 1988-05-17 |
Family
ID=31101950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16876886U Pending JPS6373934U (en) | 1986-10-31 | 1986-10-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6373934U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05123658A (en) * | 1991-10-17 | 1993-05-21 | Japan Field Kk | Method for cleaning body to be cleaned and apparatus therefor |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6049642A (en) * | 1983-08-29 | 1985-03-18 | Nec Corp | Inspecting apparatus for semiconductor device |
JPS60211900A (en) * | 1984-04-06 | 1985-10-24 | 日立電子エンジニアリング株式会社 | Synchronous conveying mechanism for ic handler |
-
1986
- 1986-10-31 JP JP16876886U patent/JPS6373934U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6049642A (en) * | 1983-08-29 | 1985-03-18 | Nec Corp | Inspecting apparatus for semiconductor device |
JPS60211900A (en) * | 1984-04-06 | 1985-10-24 | 日立電子エンジニアリング株式会社 | Synchronous conveying mechanism for ic handler |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05123658A (en) * | 1991-10-17 | 1993-05-21 | Japan Field Kk | Method for cleaning body to be cleaned and apparatus therefor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6373934U (en) | ||
JPH0312439U (en) | ||
JPH0412647U (en) | ||
JPS62136432U (en) | ||
JPH044752U (en) | ||
JPH0193732U (en) | ||
JPS646044U (en) | ||
JPS6398643U (en) | ||
JPS6344443U (en) | ||
JP2788816B2 (en) | IC package positioning device | |
JPS61164042U (en) | ||
JPH0372377U (en) | ||
JPH02113330U (en) | ||
JPS63100837U (en) | ||
JPS60927U (en) | Semiconductor wafer pasting equipment | |
JPS63134541U (en) | ||
JPS6430837U (en) | ||
JPS617032U (en) | semiconductor equipment | |
JPS62165575U (en) | ||
JPH0459147U (en) | ||
JPS63195734U (en) | ||
JPS61201345U (en) | ||
JPS6398633U (en) | ||
JPH0158181U (en) | ||
JPS58120655U (en) | Adhesive sheet for wafer dicing |