JPH0158942U - - Google Patents
Info
- Publication number
- JPH0158942U JPH0158942U JP15511287U JP15511287U JPH0158942U JP H0158942 U JPH0158942 U JP H0158942U JP 15511287 U JP15511287 U JP 15511287U JP 15511287 U JP15511287 U JP 15511287U JP H0158942 U JPH0158942 U JP H0158942U
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- wafer
- contact
- comes
- pasting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 claims 4
- 230000005611 electricity Effects 0.000 claims 1
- 230000003068 static effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Description
第１図は本考案の第１の実施例を示す構成図、
第２図は本考案の第２の実施例を示す構成図、第
３図は本考案の第３の実施例を示す構成図、第４
図、第５図は従来のウエハ貼付器の構成図である
。
１１ａ，２１ａ，３１ａ……ビニールシート（
シート）、１３，２３，３３……ウエハ、１５，
１６，２５，２６……ローラ（導電性接触部材）
、３５，３６……接触片（導電性接触部材）。
FIG. 1 is a configuration diagram showing a first embodiment of the present invention;
Fig. 2 is a block diagram showing a second embodiment of the present invention, Fig. 3 is a block diagram showing a third embodiment of the present invention, and Fig. 4 is a block diagram showing a third embodiment of the present invention.
FIG. 5 is a configuration diagram of a conventional wafer pasting device. 11a, 21a, 31a...vinyl sheet (
sheet), 13, 23, 33... wafer, 15,
16, 25, 26...roller (conductive contact member)
, 35, 36... Contact piece (conductive contact member).
Claims (1)
いて、 上記シートがウエハに接触する前に接触する接
地した導電性接触部材を備えたことを特徴とする
静電気除去機能付きウエハ貼付器。[Claims for Utility Model Registration] A wafer pasting device for pasting wafers onto a sheet with a static electricity removal function, characterized in that the sheet is equipped with a grounded conductive contact member that comes into contact with the wafer before the sheet comes into contact with the wafer. vessel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15511287U JPH0158942U (en) | 1987-10-09 | 1987-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15511287U JPH0158942U (en) | 1987-10-09 | 1987-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0158942U true JPH0158942U (en) | 1989-04-13 |
Family
ID=31432442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15511287U Pending JPH0158942U (en) | 1987-10-09 | 1987-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0158942U (en) |
-
1987
- 1987-10-09 JP JP15511287U patent/JPH0158942U/ja active Pending