JPH0425231U - - Google Patents
Info
- Publication number
- JPH0425231U JPH0425231U JP6777590U JP6777590U JPH0425231U JP H0425231 U JPH0425231 U JP H0425231U JP 6777590 U JP6777590 U JP 6777590U JP 6777590 U JP6777590 U JP 6777590U JP H0425231 U JPH0425231 U JP H0425231U
- Authority
- JP
- Japan
- Prior art keywords
- clamp claw
- wafer
- tip
- curved surface
- dry etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 2
Description
第１図はこの考案の一実施例を示すドライエツ
チング装置におけるウエーハクランプ部の断面図
、第２図は、従来のウエーハクランプ部の断面図
である。
１……ウエーハ、２……クランプ爪、２ｂ……
先端（曲面）、４……電極ステージ。
FIG. 1 is a sectional view of a wafer clamp section in a dry etching apparatus showing an embodiment of this invention, and FIG. 2 is a sectional view of a conventional wafer clamp section. 1...Wafer, 2...Clamp claw, 2b...
Tip (curved surface), 4...electrode stage.
Claims (1)
、クランプ爪を設けているドライエツチング装置
において、上記クランプ爪の先端を曲面に形成し
たことを特徴とするドライエツチング装置。 A dry etching apparatus provided with a clamp claw as a means for holding a wafer on an electrode stage, characterized in that the tip of the clamp claw is formed into a curved surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6777590U JPH0425231U (en) | 1990-06-25 | 1990-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6777590U JPH0425231U (en) | 1990-06-25 | 1990-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0425231U true JPH0425231U (en) | 1992-02-28 |
Family
ID=31601652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6777590U Pending JPH0425231U (en) | 1990-06-25 | 1990-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0425231U (en) |
-
1990
- 1990-06-25 JP JP6777590U patent/JPH0425231U/ja active Pending