JPH0371623U - - Google Patents

Info

Publication number
JPH0371623U
JPH0371623U JP13308789U JP13308789U JPH0371623U JP H0371623 U JPH0371623 U JP H0371623U JP 13308789 U JP13308789 U JP 13308789U JP 13308789 U JP13308789 U JP 13308789U JP H0371623 U JPH0371623 U JP H0371623U
Authority
JP
Japan
Prior art keywords
heat treatment
boat
semiconductor wafers
surface area
increased
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13308789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13308789U priority Critical patent/JPH0371623U/ja
Publication of JPH0371623U publication Critical patent/JPH0371623U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は本考案の第1の実施例を示
す図、第3図及び第4図は本考案の第2の実施例
を示す図、第5図及び第6図は本考案の第3の実
施例を示す図、第7図及び第8図は従来の技術を
示す図である。 21,25,29……熱処理用ボート、22,
26……炉心管、23,27,30……半導体ウ
エハー、24……溝、28……凹部、31……穴
1 and 2 are views showing a first embodiment of the present invention, FIGS. 3 and 4 are views showing a second embodiment of the present invention, and FIGS. 5 and 6 are views showing a second embodiment of the present invention. FIGS. 7 and 8 are diagrams showing a conventional technique. 21, 25, 29... Heat treatment boat, 22,
26... Furnace tube, 23, 27, 30... Semiconductor wafer, 24... Groove, 28... Recess, 31... Hole.

Claims (1)

【実用新案登録請求の範囲】 半導体ウエハーの熱処理時に前記半導体ウエハ
ーを載置して熱処理装置へ挿入される熱処理用ボ
ートにおいて、 この熱処理用ボートを構成する部材の表面積を
大きくした事を特徴とする熱処理用ボート。
[Claims for Utility Model Registration] A heat treatment boat on which semiconductor wafers are placed and inserted into a heat treatment apparatus during heat treatment of semiconductor wafers is characterized in that the surface area of the members constituting the heat treatment boat is increased. Boat for heat treatment.
JP13308789U 1989-11-17 1989-11-17 Pending JPH0371623U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13308789U JPH0371623U (en) 1989-11-17 1989-11-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13308789U JPH0371623U (en) 1989-11-17 1989-11-17

Publications (1)

Publication Number Publication Date
JPH0371623U true JPH0371623U (en) 1991-07-19

Family

ID=31680503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13308789U Pending JPH0371623U (en) 1989-11-17 1989-11-17

Country Status (1)

Country Link
JP (1) JPH0371623U (en)

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