JPH0224534U

JPH0224534U -

Info

Publication number: JPH0224534U
Application number: JP10241788U
Authority: JP
Priority date: 1988-08-03
Filing date: 1988-08-03
Publication date: 1990-02-19

Description

[Brief explanation of the drawing]

第１図は本考案の実施例を示すドライエツチン
グ装置におけるウエハ固定装置の平面図、第２図
は第１図のＡ−Ａ線断面図、第３図は本考案の実
施例を示すウエハ固定装置のウエハ押さえ機構の
側面図、第４図は従来のドライエツチング装置の
ウエハ固定装置の平面図である。１１……ウエハ、１２，１２′，１５，１５′
……ウエハ押さえ、１３……ウエハ押さえガイド
穴、１４……ウエハエツチンク性が悪い部分、１
６……下部電極、２１，２２……パルスモータ、
２３，２４……伝動部材、２５……支持軸。 Fig. 1 is a plan view of a wafer fixing device in a dry etching apparatus showing an embodiment of the present invention, Fig. 2 is a sectional view taken along line A-A in Fig. 1, and Fig. 3 is a wafer fixing device showing an embodiment of the present invention. FIG. 4 is a side view of the wafer holding mechanism of the apparatus, and a plan view of the wafer holding device of the conventional dry etching apparatus. 11...Wafer, 12, 12', 15, 15'
...Wafer holding, 13... Wafer holding guide hole, 14... Portion with poor wafer etching properties, 1
6... Lower electrode, 21, 22... Pulse motor,
23, 24... Transmission member, 25... Support shaft.

Claims

[Scope of Claim for Utility Model Registration] A wafer fixing device in a dry etching apparatus that fixes a wafer in an etching chamber, comprising: (a) a lower electrode on which the wafer is placed; (b) a circumferential direction of the lower electrode; A wafer fixing device for a dry etching apparatus, comprising: a guide hole formed therein; and (c) a wafer holder inserted through the guide hole and movable in the circumferential direction of the wafer.