JPS6351435U - - Google Patents
Info
- Publication number
- JPS6351435U JPS6351435U JP14604286U JP14604286U JPS6351435U JP S6351435 U JPS6351435 U JP S6351435U JP 14604286 U JP14604286 U JP 14604286U JP 14604286 U JP14604286 U JP 14604286U JP S6351435 U JPS6351435 U JP S6351435U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- chuck
- spraying
- development processing
- developer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims 2
- 210000000078 claw Anatomy 0.000 description 1
Description
第１図は本考案に係る現像装置の一実施例を示
す側断面図、第２図は第１図のチヤツク２の平面
図、第３図は従来の現像装置の側断面図である。
１……半導体ウエハー、２……チヤツク、３…
…スピンシヤフト、４……カツプ、５……ノズル
、６……現像液、７……排液口、１０……ツメ。
FIG. 1 is a side sectional view showing an embodiment of the developing device according to the present invention, FIG. 2 is a plan view of the chuck 2 shown in FIG. 1, and FIG. 3 is a side sectional view of a conventional developing device. 1...Semiconductor wafer, 2...Chick, 3...
... spin shaft, 4 ... cup, 5 ... nozzle, 6 ... developer, 7 ... drain port, 10 ... claw.
Claims (1)
を回転させることにより半導体ウエハーを回転さ
せて、半導体ウエハーに向けて現像液を吹き付け
て現像処理を行なう装置において、 半導体ウエハーを垂直に支持し、その周囲から
現像液を吹き付けて半導体ウエハーの両面を現像
処理可能とする半導体ウエハー支持手段を具備し
たことを特徴とする現像装置。[Scope of Claim for Utility Model Registration] In an apparatus that performs development processing by fixing a semiconductor wafer with a chuck, rotating the chuck to rotate the semiconductor wafer, and spraying a developer toward the semiconductor wafer, 1. A developing device comprising: a semiconductor wafer support means for supporting the semiconductor wafer on the wafer and spraying a developer from around the semiconductor wafer supporting means to enable development processing on both sides of the semiconductor wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14604286U JPS6351435U (en) | 1986-09-22 | 1986-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14604286U JPS6351435U (en) | 1986-09-22 | 1986-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6351435U true JPS6351435U (en) | 1988-04-07 |
Family
ID=31058140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14604286U Pending JPS6351435U (en) | 1986-09-22 | 1986-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6351435U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014103274A (en) * | 2012-11-20 | 2014-06-05 | Shindengen Electric Mfg Co Ltd | Resist developing device, resist developing method and method for manufacturing semiconductor device |
-
1986
- 1986-09-22 JP JP14604286U patent/JPS6351435U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014103274A (en) * | 2012-11-20 | 2014-06-05 | Shindengen Electric Mfg Co Ltd | Resist developing device, resist developing method and method for manufacturing semiconductor device |