JPS62201931U - - Google Patents
Info
- Publication number
- JPS62201931U JPS62201931U JP9156586U JP9156586U JPS62201931U JP S62201931 U JPS62201931 U JP S62201931U JP 9156586 U JP9156586 U JP 9156586U JP 9156586 U JP9156586 U JP 9156586U JP S62201931 U JPS62201931 U JP S62201931U
- Authority
- JP
- Japan
- Prior art keywords
- spin
- processed
- guide
- spin head
- tapered surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004381 surface treatment Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Description
第１図はこの考案のスピン処理装置の一実施例
の構成を示す断面図、第２図は同上スピン処理装
置のガイドが待機している状態の断面図、第３図
は従来のスピン処理装置の断面図、第４図は従来
のスピン処理装置による芯出し方法を説明するた
めの断面図、第５図は第４図の平面図である。
１…スピンヘツド、３…カツプ、５…ウエハ（
被処理体）、６…処理液、７…ガイド、８…押し
ばね、９…エアシリンダ。なお、図中同一符号は
同一又は相当部分を示す。
Fig. 1 is a sectional view showing the configuration of an embodiment of the spin processing device of this invention, Fig. 2 is a sectional view of the same spin processing device in a state where the guide is on standby, and Fig. 3 is a conventional spin processing device. FIG. 4 is a cross-sectional view for explaining a centering method using a conventional spin processing apparatus, and FIG. 5 is a plan view of FIG. 4. 1...Spin head, 3...Cup, 5...Wafer (
Object to be processed), 6... Processing liquid, 7... Guide, 8... Pressing spring, 9... Air cylinder. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
て表面処理を行うスピン処理装置において、上記
被処理体を回転させるスピンヘツドと、前記スピ
ンヘツドの上方に配設され且つ内部に上記被処理
体の外周面が当接するテーパー面を形成したガイ
ドとを有し、上記ガイドにより、上記被処理体を
上記スピンヘツド上の定位置に位置決めすること
を特徴とするスピン処理装置。 (2) ガイドの内部に形成されたテーパー面の中
心がスピンヘツドの回転軸芯と一致するようにし
たことを特徴とする実用新案登録請求の範囲第１
項記載のスピン処理装置。 (3) ガイドの内部に形成されたテーパー面が円
錐状であることを特徴とする実用新案登録請求の
範囲第１項または第２項記載のスピン処理装置。[Claims for Utility Model Registration] (1) A spin processing apparatus that performs surface treatment by rotating a flat object to be processed, such as a wafer, including a spin head for rotating the object to be processed, and a spin head disposed above the spin head. and a guide in which a tapered surface is formed with which the outer circumferential surface of the object to be processed comes into contact, and the guide positions the object to be processed at a fixed position on the spin head. Device. (2) Claim 1 of the utility model registration, characterized in that the center of the tapered surface formed inside the guide coincides with the rotational axis of the spin head.
The spin processing device described in Section 1. (3) The spin processing device according to claim 1 or 2, wherein the tapered surface formed inside the guide is conical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9156586U JPS62201931U (en) | 1986-06-16 | 1986-06-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9156586U JPS62201931U (en) | 1986-06-16 | 1986-06-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62201931U true JPS62201931U (en) | 1987-12-23 |
Family
ID=30952467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9156586U Pending JPS62201931U (en) | 1986-06-16 | 1986-06-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62201931U (en) |
-
1986
- 1986-06-16 JP JP9156586U patent/JPS62201931U/ja active Pending