JPS62190338U - - Google Patents
Info
- Publication number
- JPS62190338U JPS62190338U JP7878886U JP7878886U JPS62190338U JP S62190338 U JPS62190338 U JP S62190338U JP 7878886 U JP7878886 U JP 7878886U JP 7878886 U JP7878886 U JP 7878886U JP S62190338 U JPS62190338 U JP S62190338U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- semiconductor wafer
- resist solution
- tip
- dropping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Weting (AREA)
Description
第１図は本考案のデイスペンスノズルを説明す
る断面図であり、第２図は第１図のデイスペンス
ノズルの作用を説明する断面図である。第３図は
従来の成膜装置を説明する一部断面図であり、第
４図はデイスペンスノズルの断面図である。
１……半導体ウエハ、３……レジスト液、４Ａ
……デイスペンスノズル、６……ノズル部、７…
…カバー、８……先端。
FIG. 1 is a sectional view illustrating the dispense nozzle of the present invention, and FIG. 2 is a sectional view illustrating the operation of the dispense nozzle of FIG. 1. FIG. 3 is a partial sectional view illustrating a conventional film forming apparatus, and FIG. 4 is a sectional view of a dispense nozzle. 1...Semiconductor wafer, 3...Resist liquid, 4A
... Dispense nozzle, 6 ... Nozzle part, 7 ...
...Cover, 8...Tip.
Claims (1)
ンスノズルにおいて、前記レジスト液を吐出する
ノズル先端を囲みこの先端よりも前記半導体ウエ
ハ側に突出する筒状のカバーが設けられているこ
とを特徴とするデイスペンスノズル。 A dispense nozzle for dropping a resist solution onto a semiconductor wafer, characterized in that a cylindrical cover is provided that surrounds a tip of the nozzle that discharges the resist solution and projects from the tip toward the semiconductor wafer. nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7878886U JPS62190338U (en) | 1986-05-27 | 1986-05-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7878886U JPS62190338U (en) | 1986-05-27 | 1986-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62190338U true JPS62190338U (en) | 1987-12-03 |
Family
ID=30928048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7878886U Pending JPS62190338U (en) | 1986-05-27 | 1986-05-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62190338U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5081067A (en) * | 1973-11-16 | 1975-07-01 | ||
| JPS528383U (en) * | 1975-07-02 | 1977-01-20 | ||
| JPS6122627A (en) * | 1984-07-10 | 1986-01-31 | Mitsubishi Electric Corp | Photo-sensitive resin coating nozzle |
-
1986
- 1986-05-27 JP JP7878886U patent/JPS62190338U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5081067A (en) * | 1973-11-16 | 1975-07-01 | ||
| JPS528383U (en) * | 1975-07-02 | 1977-01-20 | ||
| JPS6122627A (en) * | 1984-07-10 | 1986-01-31 | Mitsubishi Electric Corp | Photo-sensitive resin coating nozzle |
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