JPH0289833U - - Google Patents
Info
- Publication number
- JPH0289833U JPH0289833U JP16984688U JP16984688U JPH0289833U JP H0289833 U JPH0289833 U JP H0289833U JP 16984688 U JP16984688 U JP 16984688U JP 16984688 U JP16984688 U JP 16984688U JP H0289833 U JPH0289833 U JP H0289833U
- Authority
- JP
- Japan
- Prior art keywords
- squeegee
- solder
- printing device
- utility
- cylindrical shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000006071 cream Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案の一実施例による半田印刷装
置を示す斜視図、第２図は従来の半田印刷装置を
示す斜視図である。図において １は半導体基板
、２はテーブル、３は印刷マスク、５は半田クリ
ーム、６は筒形スキージを示す。なお、図中、同
一符号は同一、又は相当部分を示す。
FIG. 1 is a perspective view showing a solder printing device according to an embodiment of this invention, and FIG. 2 is a perspective view showing a conventional solder printing device. In the figure, 1 is a semiconductor substrate, 2 is a table, 3 is a printing mask, 5 is solder cream, and 6 is a cylindrical squeegee. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
ームをスキージで周囲を取り囲む筒形状としたこ
とを特徴とする半田印刷装置用スキージ。 A squeegee for a solder printing device for semiconductor substrates, characterized in that the squeegee has a cylindrical shape surrounding the solder cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16984688U JPH0289833U (en) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16984688U JPH0289833U (en) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289833U true JPH0289833U (en) | 1990-07-17 |
Family
ID=31460268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16984688U Pending JPH0289833U (en) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289833U (en) |
-
1988
- 1988-12-28 JP JP16984688U patent/JPH0289833U/ja active Pending