JPH01127669U - - Google Patents
Info
- Publication number
- JPH01127669U JPH01127669U JP2085188U JP2085188U JPH01127669U JP H01127669 U JPH01127669 U JP H01127669U JP 2085188 U JP2085188 U JP 2085188U JP 2085188 U JP2085188 U JP 2085188U JP H01127669 U JPH01127669 U JP H01127669U
- Authority
- JP
- Japan
- Prior art keywords
- hot air
- air supply
- supply devices
- soldering device
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の構成を示す正面図、第２図１
，２，３は、本考案の使用例を示すプリント基板
の平面図及び本考案の構成を示す正面図、第３図
は従来例を示す図である。図中同一部分は同一符
号を用いて説明する。
１……熱風供給装置、２……熱風供給装置、３
……プリント基板、４……半導体素子、Ｐ……半
田。
Figure 1 is a front view showing the configuration of the present invention, Figure 2
, 2 and 3 are a plan view of a printed circuit board showing an example of use of the present invention, and a front view showing the configuration of the present invention, and FIG. 3 is a diagram showing a conventional example. Identical parts in the figures will be explained using the same reference numerals. 1...Hot air supply device, 2...Hot air supply device, 3
...Printed circuit board, 4...semiconductor element, P...solder.
Claims (1)
半導体素子を熱風を供給して実装する半田付装置
において、少なくとも、第１と第２の熱風供給装
置を上下対抗して具備し、プリント基板の両平面
に対し前記第１及び第２の熱風供給装置から熱風
を供給することを特徴とする半田付装置。 A soldering device for mounting flat package type semiconductor elements on a flat surface of a printed circuit board by supplying hot air includes at least first and second hot air supply devices vertically opposed to each other, and On the other hand, a soldering device characterized in that hot air is supplied from the first and second hot air supply devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2085188U JPH01127669U (en) | 1988-02-19 | 1988-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2085188U JPH01127669U (en) | 1988-02-19 | 1988-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01127669U true JPH01127669U (en) | 1989-08-31 |
Family
ID=31237572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2085188U Pending JPH01127669U (en) | 1988-02-19 | 1988-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01127669U (en) |
-
1988
- 1988-02-19 JP JP2085188U patent/JPH01127669U/ja active Pending