JPH01123380U - - Google Patents
Info
- Publication number
- JPH01123380U JPH01123380U JP1889088U JP1889088U JPH01123380U JP H01123380 U JPH01123380 U JP H01123380U JP 1889088 U JP1889088 U JP 1889088U JP 1889088 U JP1889088 U JP 1889088U JP H01123380 U JPH01123380 U JP H01123380U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- substrate
- pads
- leads
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の実施例を示す正面図、第２図
は基板を示す斜視説明図、第３図は半導体素子の
側面図、第４図は従来例を示す説明図である。
第１図において、１は基板、２はパツド、３，
３０は半導体素子、４はリードである。
FIG. 1 is a front view showing an embodiment of the present invention, FIG. 2 is a perspective explanatory view showing a substrate, FIG. 3 is a side view of a semiconductor element, and FIG. 4 is an explanatory view showing a conventional example. In Fig. 1, 1 is a board, 2 is a pad, 3,
30 is a semiconductor element, and 4 is a lead.
Claims (1)
体素子３のリード４を接続してなることを特徴と
する基板への半導体素子の実装構造。 A structure for mounting a semiconductor element on a substrate, characterized in that leads 4 of a semiconductor element 3 are connected to pads 2 arranged in parallel on the front and back edges of the substrate 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1889088U JPH01123380U (en) | 1988-02-16 | 1988-02-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1889088U JPH01123380U (en) | 1988-02-16 | 1988-02-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123380U true JPH01123380U (en) | 1989-08-22 |
Family
ID=31233929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1889088U Pending JPH01123380U (en) | 1988-02-16 | 1988-02-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123380U (en) |
-
1988
- 1988-02-16 JP JP1889088U patent/JPH01123380U/ja active Pending