JPH0215862U - - Google Patents
Info
- Publication number
- JPH0215862U JPH0215862U JP9389288U JP9389288U JPH0215862U JP H0215862 U JPH0215862 U JP H0215862U JP 9389288 U JP9389288 U JP 9389288U JP 9389288 U JP9389288 U JP 9389288U JP H0215862 U JPH0215862 U JP H0215862U
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- holder
- semiconductor substrates
- water
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の研磨ホルダを用いた研磨状態
の基板保持部分の一実施例を示す一部断面図、第
２図は本考案の研磨ホルダを用いた研磨装置の一
実施例を示す正面図である。
１…基板、２…ホルダ、３…研磨皿、４…主軸
、５…本体、６…エツチヤントタンク、７…弁、
８…ノズル、９…水タンク、１０…弁、１１…ア
ーム、１２…貫通穴、１３…自在継手、１４…ホ
ース、１５…配管軸、１６…Ｔ型穴、１７…スリ
ツプリング、１８…パイプ。
FIG. 1 is a partial sectional view showing an example of a substrate holding part in a polished state using the polishing holder of the present invention, and FIG. 2 is a front view showing an example of a polishing apparatus using the polishing holder of the present invention. It is a diagram. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Holder, 3...Polishing dish, 4...Main shaft, 5...Main body, 6...Etchant tank, 7...Valve,
8... Nozzle, 9... Water tank, 10... Valve, 11... Arm, 12... Through hole, 13... Universal joint, 14... Hose, 15... Piping shaft, 16... T-shaped hole, 17... Slip ring, 18... Pipe .
Claims (1)
を保持して、研磨皿上に供給された水溶性エツチ
ヤントのハイドロプレーン効果により、前記基板
を浮上させ、加工する研磨装置に用いる該基板保
持用研磨ホルダにおいて、該ホルダ中心に水を研
磨皿面に供給する貫通穴を備えることを特徴とす
る研磨ホルダ。 A polishing device for holding a plurality of semiconductor substrates used in a polishing device that holds a plurality of semiconductor substrates facing a rotating polishing plate and levitates and processes the substrates by the hydroplane effect of a water-soluble etchant supplied onto the polishing plate. A polishing holder characterized in that the holder is provided with a through hole in the center thereof for supplying water to the surface of the polishing dish.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9389288U JPH0215862U (en) | 1988-07-14 | 1988-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9389288U JPH0215862U (en) | 1988-07-14 | 1988-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215862U true JPH0215862U (en) | 1990-01-31 |
Family
ID=31318370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9389288U Pending JPH0215862U (en) | 1988-07-14 | 1988-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215862U (en) |
-
1988
- 1988-07-14 JP JP9389288U patent/JPH0215862U/ja active Pending
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