JPS6150631U - - Google Patents
Info
- Publication number
- JPS6150631U JPS6150631U JP1984135757U JP13575784U JPS6150631U JP S6150631 U JPS6150631 U JP S6150631U JP 1984135757 U JP1984135757 U JP 1984135757U JP 13575784 U JP13575784 U JP 13575784U JP S6150631 U JPS6150631 U JP S6150631U
- Authority
- JP
- Japan
- Prior art keywords
- vacuum chuck
- workpiece
- polishing liquid
- chemical polishing
- distortion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 239000004744 fabric Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Jigs For Machine Tools (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
第１図は本考案の無歪鏡面研摩装置のウエハチ
ヤツク構造の一実施例を説明する図、第２図は、
従来の無歪鏡面研摩装置のウエハチヤツクの一例
を説明する図である。
図において、１と１′はウエハ、２と２′はチ
ヤツク、３はハウジング、４は中空部、５は吸引
穴、６はパツド、７はパツド６を埋込んだハウジ
ングを示す。
FIG. 1 is a diagram illustrating an embodiment of the wafer chuck structure of the distortion-free mirror polishing apparatus of the present invention, and FIG.
FIG. 2 is a diagram illustrating an example of a wafer chuck of a conventional distortion-free mirror polishing apparatus. In the figure, 1 and 1' are wafers, 2 and 2' are chucks, 3 is a housing, 4 is a hollow part, 5 is a suction hole, 6 is a pad, and 7 is a housing in which the pad 6 is embedded.
Claims (1)
摩布面上で該被加工物を摺動運動させながら化学
研摩液を供給して加工する無歪鏡面研摩装置にお
ける真空チヤツクにおいて、被加工物の外周部分
に対向した真空チヤツク面上に帯状の弾性体パツ
ドを形成し、被加工物裏面への化学研摩液の囲り
込みを防止した構造とすることを特徴とする真空
チヤツク。 In the vacuum chuck of a distortion-free mirror polishing device, the workpiece is sucked and held by a vacuum chuck, and processed by supplying a chemical polishing liquid while sliding the workpiece on the surface of the polishing cloth. A vacuum chuck characterized by having a structure in which a band-shaped elastic pad is formed on the surface of the vacuum chuck facing the part to prevent chemical polishing liquid from being enclosed on the back surface of the workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984135757U JPS6150631U (en) | 1984-09-07 | 1984-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984135757U JPS6150631U (en) | 1984-09-07 | 1984-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6150631U true JPS6150631U (en) | 1986-04-05 |
Family
ID=30694239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984135757U Pending JPS6150631U (en) | 1984-09-07 | 1984-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6150631U (en) |
-
1984
- 1984-09-07 JP JP1984135757U patent/JPS6150631U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0560250B2 (en) | ||
| JPS6150631U (en) | ||
| JPS6190243U (en) | ||
| JPH03128943U (en) | ||
| JPS6096825U (en) | cleaning brush | |
| JPH0639869Y2 (en) | Vacuum chuck | |
| JPH01129824U (en) | ||
| JPS63103957U (en) | ||
| JPS6067365U (en) | Etching processing equipment | |
| JPS62118443U (en) | ||
| JPS61125041U (en) | ||
| JPS5939160U (en) | polishing jig | |
| JPS6295863U (en) | ||
| JPS645444U (en) | ||
| JPS6120047U (en) | Semiconductor wafer mounting device | |
| JPS6394657U (en) | ||
| JPS6084251U (en) | Planetary rotary polishing device | |
| JPH0215864U (en) | ||
| JPH0438037U (en) | ||
| JPS6377344U (en) | ||
| JPS6332847U (en) | ||
| JPH01161334U (en) | ||
| JPH02132941U (en) | ||
| JPH0166962U (en) | ||
| JPS62127733U (en) |