JPS645444U - - Google Patents
Info
- Publication number
- JPS645444U JPS645444U JP9983987U JP9983987U JPS645444U JP S645444 U JPS645444 U JP S645444U JP 9983987 U JP9983987 U JP 9983987U JP 9983987 U JP9983987 U JP 9983987U JP S645444 U JPS645444 U JP S645444U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- pattern
- formed surface
- periphery
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 4
- 239000007779 soft material Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
Landscapes
- Weting (AREA)
Description
第1図は本考案の実施例に係るエツチング用治
具を示し、aは使用状態の斜視図、bは分解斜視
図であり、第2図はその使用状態の断面図である
。
1……エツチング用治具、2……保護プレート
、3……押えリング、4……クリツプ、10……
半導体ウエーハ、11……パターン形成面、12
……研削面。
FIG. 1 shows an etching jig according to an embodiment of the present invention, in which a is a perspective view of the device in use, b is an exploded perspective view, and FIG. 2 is a cross-sectional view of the device in use. 1... Etching jig, 2... Protective plate, 3... Holding ring, 4... Clip, 10...
Semiconductor wafer, 11... Pattern formation surface, 12
...Grinding surface.
Claims (1)
接し、前記パターン形成面と所定の間隔を有して
対向されてこのパターン形成面の全面を覆う保護
プレートと、 この保護プレートとの間で前記半導体ウエーハ
を挟むように当該半導体ウエーハの研削面の周辺
部に当接される軟質材の押えリングと、 この押えリングが前記半導体ウエーハに密着す
るように前記保護プレートと押えリングとを挟持
するクリツプとを備え、 前記半導体ウエーハを保持した状態でエツチン
グ液に浸漬されることを特徴とするエツチング用
治具。[Claims for Utility Model Registration] A protection plate that comes into contact with the periphery of a pattern-formed surface of a semiconductor wafer, faces the pattern-formed surface at a predetermined distance, and covers the entire surface of the pattern-formed surface; a presser ring made of a soft material that is brought into contact with the periphery of the ground surface of the semiconductor wafer so as to sandwich the semiconductor wafer between the plate; An etching jig comprising: a clip that holds the semiconductor wafer; and the jig is immersed in an etching solution while holding the semiconductor wafer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9983987U JPS645444U (en) | 1987-06-29 | 1987-06-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9983987U JPS645444U (en) | 1987-06-29 | 1987-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS645444U true JPS645444U (en) | 1989-01-12 |
Family
ID=31327370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9983987U Pending JPS645444U (en) | 1987-06-29 | 1987-06-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS645444U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04103404U (en) * | 1991-02-14 | 1992-09-07 | 三菱農機株式会社 | rotary tiller |
-
1987
- 1987-06-29 JP JP9983987U patent/JPS645444U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04103404U (en) * | 1991-02-14 | 1992-09-07 | 三菱農機株式会社 | rotary tiller |