JPH02113329U - - Google Patents
Info
- Publication number
- JPH02113329U JPH02113329U JP2190089U JP2190089U JPH02113329U JP H02113329 U JPH02113329 U JP H02113329U JP 2190089 U JP2190089 U JP 2190089U JP 2190089 U JP2190089 U JP 2190089U JP H02113329 U JPH02113329 U JP H02113329U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- pedestal
- shaped depression
- semiconductor
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 235000012431 wafers Nutrition 0.000 claims 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の装置の一実施例を示す構造図
、第２図は従来の装置の構造図である。
１……窪み、１１……内周部、１２……底面部
、１３……縁部、２……突起、２１……隙間、３
……着脱溝、４……半導体ウエーハ、４１……オ
リエンテーシヨンフラツト。
FIG. 1 is a structural diagram showing an embodiment of the device of the present invention, and FIG. 2 is a structural diagram of a conventional device. 1... Recess, 11... Inner periphery, 12... Bottom, 13... Edge, 2... Protrusion, 21... Gap, 3
...Attachment and removal groove, 4...Semiconductor wafer, 41...Orientation flat.
Claims (1)
ウエーハをセツトする台座であつて、半導体ウエ
ーハをセツトするためにこの半導体ウエーハの直
径よりわずか大きい直径で、この半導体ウエーハ
の厚さとほゞ同一の深さの円板状の窪みがあり、
この円板状の窪みの外周部に前記半導体の着脱を
容易にするピンセツト挿入用の着脱溝を備えた半
導体ウエーハのセツト用台座において、 半導体ウエーハがセツトされる円板状の窪みの
内周部に、前記半導体ウエーハの方向きめのオリ
エンテーシヨンフラツトに対向してこのオリエン
テーシヨンフラツトとの間にわずかに隙間を有す
る突起を設けるとともに、前記窪みの底面部を中
央部が深い球面で形成する ことを特徴とする半導体ウエーハのナンバリング
用台座。[Claims for Utility Model Registration] A pedestal on which a semiconductor wafer is set for numbering the semiconductor wafer, the pedestal having a diameter slightly larger than the diameter of the semiconductor wafer and having a diameter approximately equal to the thickness of the semiconductor wafer. There is a disc-shaped depression of the same depth,
In the pedestal for setting a semiconductor wafer, which has an attachment/detachment groove for inserting tweezers to facilitate attachment and detachment of the semiconductor on the outer periphery of the disk-shaped depression, the inner periphery of the disk-shaped depression in which the semiconductor wafer is set. A protrusion is provided opposite to the orientation flat for determining the direction of the semiconductor wafer and has a slight gap between the protrusion and the orientation flat, and the bottom of the recess is formed with a deep spherical surface in the center. A pedestal for numbering semiconductor wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2190089U JPH02113329U (en) | 1989-02-27 | 1989-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2190089U JPH02113329U (en) | 1989-02-27 | 1989-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02113329U true JPH02113329U (en) | 1990-09-11 |
Family
ID=31239537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2190089U Pending JPH02113329U (en) | 1989-02-27 | 1989-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02113329U (en) |
-
1989
- 1989-02-27 JP JP2190089U patent/JPH02113329U/ja active Pending