JPH0251059U - - Google Patents

Info

Publication number
JPH0251059U
JPH0251059U JP12821788U JP12821788U JPH0251059U JP H0251059 U JPH0251059 U JP H0251059U JP 12821788 U JP12821788 U JP 12821788U JP 12821788 U JP12821788 U JP 12821788U JP H0251059 U JPH0251059 U JP H0251059U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
holding
holder
holding plate
grindstone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12821788U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12821788U priority Critical patent/JPH0251059U/ja
Publication of JPH0251059U publication Critical patent/JPH0251059U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案に係る半導体ウエハの保持ホルダ
の実施例を示す断面図である。 3,4……ホールド板、31,41……当接面
、32,42……中空部、33,43……外周部
、A……半導体ウエハ、B……砥石。
The drawing is a sectional view showing an embodiment of a semiconductor wafer holding holder according to the present invention. 3, 4... Hold plate, 31, 41... Contact surface, 32, 42... Hollow part, 33, 43... Outer peripheral part, A... Semiconductor wafer, B... Grindstone.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 砥石で半導体ウエハの周縁を研削するために半
導体ウエハを表裏から挾持するホールド板を備え
た半導体ウエハの保持ホルダにおいて、ホールド
板の半導体ウエハへの当接面に中空部を形成して
その外周部のみが半導体ウエハに当接するように
したことを特徴とする半導体ウエハの保持ホルダ
In a semiconductor wafer holding holder equipped with a holding plate that holds the semiconductor wafer from the front and back in order to grind the peripheral edge of the semiconductor wafer with a grindstone, a hollow part is formed in the contact surface of the holding plate to the semiconductor wafer, and the outer periphery of the holding plate is A holder for holding a semiconductor wafer, characterized in that only one part of the holder contacts the semiconductor wafer.
JP12821788U 1988-09-29 1988-09-29 Pending JPH0251059U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12821788U JPH0251059U (en) 1988-09-29 1988-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12821788U JPH0251059U (en) 1988-09-29 1988-09-29

Publications (1)

Publication Number Publication Date
JPH0251059U true JPH0251059U (en) 1990-04-10

Family

ID=31381347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12821788U Pending JPH0251059U (en) 1988-09-29 1988-09-29

Country Status (1)

Country Link
JP (1) JPH0251059U (en)

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