JPH0224536U - - Google Patents
Info
- Publication number
- JPH0224536U JPH0224536U JP10134288U JP10134288U JPH0224536U JP H0224536 U JPH0224536 U JP H0224536U JP 10134288 U JP10134288 U JP 10134288U JP 10134288 U JP10134288 U JP 10134288U JP H0224536 U JPH0224536 U JP H0224536U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- recess
- rotary table
- blade
- grind
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
第１図は本考案の実施例を示す部分側断面図、
第２図は従来の研磨装置を示す側断面図である。
３……半導体ウエハ、４……ブレード、５……
回転テーブル、５ｃ……凹部。
FIG. 1 is a partial side sectional view showing an embodiment of the present invention;
FIG. 2 is a side sectional view showing a conventional polishing device. 3...Semiconductor wafer, 4...Blade, 5...
Rotary table, 5c... recess.
Claims (1)
ドにより研削する装置において、上記回転テーブ
ルにウエハ周縁部を環状に支持すると凹部を設け
ると共に、この凹部内に純水を充満して、ウエハ
中央部を支持する様にしたことを特徴とする研削
装置。 In an apparatus that uses a blade to grind the upper surface of a wafer placed on a rotary table, when the peripheral edge of the wafer is annularly supported on the rotary table, a recess is provided, and the recess is filled with pure water to support the center of the wafer. A grinding device characterized by being designed to do the following:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10134288U JPH0224536U (en) | 1988-07-29 | 1988-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10134288U JPH0224536U (en) | 1988-07-29 | 1988-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0224536U true JPH0224536U (en) | 1990-02-19 |
Family
ID=31330246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10134288U Pending JPH0224536U (en) | 1988-07-29 | 1988-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0224536U (en) |
-
1988
- 1988-07-29 JP JP10134288U patent/JPH0224536U/ja active Pending