JPH0266942U - - Google Patents
Info
- Publication number
- JPH0266942U JPH0266942U JP14663088U JP14663088U JPH0266942U JP H0266942 U JPH0266942 U JP H0266942U JP 14663088 U JP14663088 U JP 14663088U JP 14663088 U JP14663088 U JP 14663088U JP H0266942 U JPH0266942 U JP H0266942U
- Authority
- JP
- Japan
- Prior art keywords
- rotary table
- workpiece
- support spring
- distributes
- combines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
第１図は本考案の薄板の高精度加工装置におけ
る被加工物載置部の詳細を示す縦断面図、第２図
は第１図の斜視図である。
１……平面研削盤ベツト、２……回転テーブル
、３……支持ばね、４……被加工物、５……砥石
。
FIG. 1 is a longitudinal cross-sectional view showing details of a workpiece mounting section in the high-precision thin plate processing apparatus of the present invention, and FIG. 2 is a perspective view of FIG. 1. 1... Surface grinder bed, 2... Rotary table, 3... Support spring, 4... Workpiece, 5... Grindstone.
Claims (1)
装置において、前記回転テーブルに被加工物の重
量を分散する支持ばねを設けたことを特徴とする
薄板の高精度加工装置。 What is claimed is: 1. A grinding device that combines a surface grinder and a rotary table, characterized in that the rotary table is provided with a support spring that distributes the weight of a workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14663088U JPH0266942U (en) | 1988-11-11 | 1988-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14663088U JPH0266942U (en) | 1988-11-11 | 1988-11-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0266942U true JPH0266942U (en) | 1990-05-21 |
Family
ID=31416299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14663088U Pending JPH0266942U (en) | 1988-11-11 | 1988-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0266942U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0671545A (en) * | 1992-07-06 | 1994-03-15 | Amada Metrecs Co Ltd | Tool grinding attachment |
| KR100770650B1 (en) * | 2007-04-05 | 2007-10-29 | 정진성 | Automatic lappimg and polishing machine |
-
1988
- 1988-11-11 JP JP14663088U patent/JPH0266942U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0671545A (en) * | 1992-07-06 | 1994-03-15 | Amada Metrecs Co Ltd | Tool grinding attachment |
| KR100770650B1 (en) * | 2007-04-05 | 2007-10-29 | 정진성 | Automatic lappimg and polishing machine |