JPH0477256U - - Google Patents
Info
- Publication number
- JPH0477256U JPH0477256U JP12150790U JP12150790U JPH0477256U JP H0477256 U JPH0477256 U JP H0477256U JP 12150790 U JP12150790 U JP 12150790U JP 12150790 U JP12150790 U JP 12150790U JP H0477256 U JPH0477256 U JP H0477256U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- blade
- fixing table
- fixing
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第１図は本考案の一実施例に半導体ウエハーを
セツトした状態の斜視図、第２図は本考案の他の
実施例に係るウエハー固定台とウエハーを示す平
面図、第３図は従来の半導体ウエハーダイシング
装置と被加工ウエハーを示す斜視図である。
１，１１，２１……ウエハー固定台、２，１２
，２２……目立て用ボード部、３，１３，２３…
…真円出しボード部、４……ブレード、５……半
導体ウエハー。
Fig. 1 is a perspective view of a semiconductor wafer set in one embodiment of the present invention, Fig. 2 is a plan view showing a wafer fixing table and a wafer according to another embodiment of the present invention, and Fig. 3 is a conventional one. FIG. 2 is a perspective view showing a semiconductor wafer dicing apparatus and a wafer to be processed. 1, 11, 21...Wafer fixing stand, 2, 12
, 22... Sharpening board section, 3, 13, 23...
...Perfect round board section, 4...Blade, 5...Semiconductor wafer.
Claims (1)
エハー固定台と、この固定台にセツトされたウエ
ハーを切断するためのブレードとを有する半導体
ウエハーダイシング装置において、前記ウエーハ
固定台は中央部にウエハー固定部と、その周囲に
前記ブレードの目立用ボード部および真円出し用
ボード部とを備えていることを特徴とする半導体
ウエハーダイシング装置。 In a semiconductor wafer dicing apparatus that includes a wafer fixing table for fixing a semiconductor wafer to be diced and a blade for cutting the wafer set on the fixing table, the wafer fixing table has a wafer fixing part in the center thereof, and a blade for cutting the wafer set on the fixing table. A semiconductor wafer dicing apparatus characterized in that the blade includes a sharpening board part and a rounding board part surrounding the blade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12150790U JPH0477256U (en) | 1990-11-20 | 1990-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12150790U JPH0477256U (en) | 1990-11-20 | 1990-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0477256U true JPH0477256U (en) | 1992-07-06 |
Family
ID=31869360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12150790U Pending JPH0477256U (en) | 1990-11-20 | 1990-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0477256U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003168658A (en) * | 2001-12-04 | 2003-06-13 | Tokyo Seimitsu Co Ltd | Singularization apparatus having dress bar |
| JP2006218571A (en) * | 2005-02-10 | 2006-08-24 | Disco Abrasive Syst Ltd | Dressing board and dressing method |
| JP2011183501A (en) * | 2010-03-08 | 2011-09-22 | Disco Corp | Dressing method of cutting blade |
-
1990
- 1990-11-20 JP JP12150790U patent/JPH0477256U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003168658A (en) * | 2001-12-04 | 2003-06-13 | Tokyo Seimitsu Co Ltd | Singularization apparatus having dress bar |
| JP2006218571A (en) * | 2005-02-10 | 2006-08-24 | Disco Abrasive Syst Ltd | Dressing board and dressing method |
| JP2011183501A (en) * | 2010-03-08 | 2011-09-22 | Disco Corp | Dressing method of cutting blade |