JPH01149258U - - Google Patents
Info
- Publication number
- JPH01149258U JPH01149258U JP4445088U JP4445088U JPH01149258U JP H01149258 U JPH01149258 U JP H01149258U JP 4445088 U JP4445088 U JP 4445088U JP 4445088 U JP4445088 U JP 4445088U JP H01149258 U JPH01149258 U JP H01149258U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- polishing
- plate
- polished
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 13
- 239000004744 fabric Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 5
- 238000000034 method Methods 0.000 description 2
Description
第１図は円形ウエハに対する研磨プレートに本
考案を適用した例を示す斜視図。第２図は矩形ウ
エハに対する研磨プレートに本考案を適用した例
を示す斜視図。第３図は本考案の研磨プレートに
よりウエハを研磨している工程の断面図。第４図
は従来の平坦な研磨プレートによりウエハを研磨
している工程の断面図。
１……研磨プレート、２……定盤、３……研磨
布、４……ウエハ、５……研磨液、６……ウエハ
形隆起部、７……ワツクス、８……基準面。
FIG. 1 is a perspective view showing an example in which the present invention is applied to a polishing plate for circular wafers. FIG. 2 is a perspective view showing an example in which the present invention is applied to a polishing plate for rectangular wafers. FIG. 3 is a cross-sectional view of the process of polishing a wafer using the polishing plate of the present invention. FIG. 4 is a cross-sectional view of the process of polishing a wafer using a conventional flat polishing plate. DESCRIPTION OF SYMBOLS 1... Polishing plate, 2... Surface plate, 3... Polishing cloth, 4... Wafer, 5... Polishing liquid, 6... Wafer-shaped protuberance, 7... Wax, 8... Reference surface.
Claims (1)
つた回転する定盤２の上へ押しつけ、研磨液５を
供給しながらウエハ４を研磨することとした研磨
プレートであつて、ウエハ４を貼りつけるべき下
面に研磨すべきウエハとほぼ同一寸法、形状のウ
エハ形隆起部６を設けてあることを特徴とする研
磨プレート。 This polishing plate has a thin wafer 4 attached to its lower surface and is pressed onto a rotating surface plate 2 on which a polishing cloth 3 is attached to polish the wafer 4 while supplying a polishing liquid 5. A polishing plate characterized in that a wafer-shaped raised portion 6 having approximately the same size and shape as the wafer to be polished is provided on the lower surface to be polished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4445088U JPH01149258U (en) | 1988-03-31 | 1988-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4445088U JPH01149258U (en) | 1988-03-31 | 1988-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01149258U true JPH01149258U (en) | 1989-10-16 |
Family
ID=31270805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4445088U Pending JPH01149258U (en) | 1988-03-31 | 1988-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01149258U (en) |
-
1988
- 1988-03-31 JP JP4445088U patent/JPH01149258U/ja active Pending