JPH0377447U - - Google Patents

Info

Publication number
JPH0377447U
JPH0377447U JP13745189U JP13745189U JPH0377447U JP H0377447 U JPH0377447 U JP H0377447U JP 13745189 U JP13745189 U JP 13745189U JP 13745189 U JP13745189 U JP 13745189U JP H0377447 U JPH0377447 U JP H0377447U
Authority
JP
Japan
Prior art keywords
jig
plate
wafers
bonding
shaped jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13745189U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13745189U priority Critical patent/JPH0377447U/ja
Publication of JPH0377447U publication Critical patent/JPH0377447U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例を示す研摩後ウエ
ーハ用貼着治具の斜視図である。第2図は治具に
ウエーハをワツクスにて貼り付けた状態を表し、
第3図にa−a′線に沿う断面図を示している。
第4図は従来のウエーハ貼着治具の斜視図、第5
図は、従来使用している研摩後ウエーハ治具にウ
エーハをワツクスで貼り付けた状態を表し、第6
図は、b−b′線に沿う断面図を示している。 1……貼着治具、2……貼着面、3……凸部、
4……凹部、5……ウエーハ、6……ワツクス。
FIG. 1 is a perspective view of a bonding jig for polished wafers showing an embodiment of this invention. Figure 2 shows the wafer attached to the jig with wax.
FIG. 3 shows a sectional view taken along line a-a'.
Figure 4 is a perspective view of a conventional wafer bonding jig;
The figure shows the wafer attached with wax to the conventionally used post-polishing wafer jig.
The figure shows a sectional view along line bb'. 1... Adhesive jig, 2... Adhesive surface, 3... Convex part,
4... recess, 5... wafer, 6... wax.

Claims (1)

【実用新案登録請求の範囲】 ウエーハを加工するために、ウエーハを貼着す
る板状治具において、 上記板状治具の貼着面を、周期的な凹凸面に形
成したことを特徴とするウエーハ加工用貼着治具
[Claims for Utility Model Registration] A plate-shaped jig for bonding wafers in order to process the wafers, characterized in that the bonding surface of the plate-shaped jig is formed into a periodically uneven surface. Adhesive jig for wafer processing.
JP13745189U 1989-11-28 1989-11-28 Pending JPH0377447U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13745189U JPH0377447U (en) 1989-11-28 1989-11-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13745189U JPH0377447U (en) 1989-11-28 1989-11-28

Publications (1)

Publication Number Publication Date
JPH0377447U true JPH0377447U (en) 1991-08-05

Family

ID=31684607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13745189U Pending JPH0377447U (en) 1989-11-28 1989-11-28

Country Status (1)

Country Link
JP (1) JPH0377447U (en)

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