JPH0456331U - - Google Patents
Info
- Publication number
- JPH0456331U JPH0456331U JP9998690U JP9998690U JPH0456331U JP H0456331 U JPH0456331 U JP H0456331U JP 9998690 U JP9998690 U JP 9998690U JP 9998690 U JP9998690 U JP 9998690U JP H0456331 U JPH0456331 U JP H0456331U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- etching
- stage
- etching stage
- dry etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims description 6
- 238000001312 dry etching Methods 0.000 claims 2
- 239000007795 chemical reaction product Substances 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
Description
第１図ａ，ｂは本考案の一実施例のエツチング
ステージの平面図及び断面図、第２図ａ，ｂ及び
第３図ａ，ｂはそれぞれ従来例のエツチングステ
ージの平面図及び断面図である。
１，１Ａ，１Ｂ……エツチングステージ、２，
２Ａ……凸状部、３……ウエーハ、４……反応生
成物。
1A and 1B are a plan view and a sectional view of an etching stage according to an embodiment of the present invention, and FIGS. 2A and 3B and 3A and 3B are a plan view and a sectional view of a conventional etching stage, respectively. be. 1, 1A, 1B...Etching stage, 2,
2A... Convex portion, 3... Wafer, 4... Reaction product.
Claims (1)
ジを有するドライエツチング装置において、前記
エツチングステージは、ウエーハ裏面の周囲が接
触するのを防止するための、ウエーハの形状を有
しかつウエーハの面積より小さい凸状部を有する
ことを特徴とするドライエツチング装置。 In a dry etching apparatus having a disk-shaped etching stage on which a wafer is placed, the etching stage has a protrusion having the shape of the wafer and smaller than the area of the wafer to prevent the periphery of the back surface of the wafer from coming into contact with the etching stage. A dry etching device characterized by having a shaped portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9998690U JPH0456331U (en) | 1990-09-25 | 1990-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9998690U JPH0456331U (en) | 1990-09-25 | 1990-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0456331U true JPH0456331U (en) | 1992-05-14 |
Family
ID=31842299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9998690U Pending JPH0456331U (en) | 1990-09-25 | 1990-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0456331U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61236137A (en) * | 1985-04-12 | 1986-10-21 | Hitachi Hokkai Semiconductor Kk | Wafer treating device |
-
1990
- 1990-09-25 JP JP9998690U patent/JPH0456331U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61236137A (en) * | 1985-04-12 | 1986-10-21 | Hitachi Hokkai Semiconductor Kk | Wafer treating device |