JPH0434738U - - Google Patents
Info
- Publication number
- JPH0434738U JPH0434738U JP7642190U JP7642190U JPH0434738U JP H0434738 U JPH0434738 U JP H0434738U JP 7642190 U JP7642190 U JP 7642190U JP 7642190 U JP7642190 U JP 7642190U JP H0434738 U JPH0434738 U JP H0434738U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- metal disk
- thinned wafer
- thinned
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 7
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Description
第１図ａ，ｂはこの考案の一実施例を示すウエ
ハ支持装置の上面図とＡ−Ａ断面図、第２図ａ，
ｂは他の実施例を示すウエハ支持装置の上面図と
Ｂ−Ｂ断面図、第３図ａ，ｂは従来の薄板化ウエ
ハの平面図とピンセツトで薄板化ウエハをつかん
だ状態を示す断面図、第４図ａ，ｂは従来の薄板
化ウエハを収納する専用平置きケースの斜視図、
第５図ａ，ｂはＧａＡｓウエハの薄板化加工前と
加工後の様子を示す断面図である。
図において、１は金属円板、２は薄板化ウエハ
、３はドーナツ状の樹脂テープ、４は貫通孔、５
はステンレス製ピンセツトである。なお、各図中
の同一符号は同一または相当部分を示す。
Figures 1a and 1b are a top view and a sectional view of a wafer support device showing an embodiment of this invention, and Figure 2a,
3b is a top view and a sectional view taken along the line B-B of a wafer support device showing another embodiment, and FIGS. 3a and 3b are a plan view of a conventional thinned wafer and a sectional view showing the state in which the thinned wafer is gripped with tweezers. , FIGS. 4a and 4b are perspective views of a dedicated flat case for storing conventional thinned wafers,
FIGS. 5a and 5b are cross-sectional views showing the GaAs wafer before and after thinning processing. In the figure, 1 is a metal disk, 2 is a thinned wafer, 3 is a donut-shaped resin tape, 4 is a through hole, and 5
are stainless steel tweezers. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
化ウエハの周辺部と金属円板上とにまたがつてド
ーナツ状の樹脂テープを配置して前記薄板化ウエ
ハを金属円板上に固定したことを特徴とするウエ
ハ支持装置。 A thinned wafer is placed on a metal disk, and a donut-shaped resin tape is placed across the periphery of the thinned wafer and the metal disk to fix the thinned wafer on the metal disk. A wafer support device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7642190U JPH0434738U (en) | 1990-07-16 | 1990-07-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7642190U JPH0434738U (en) | 1990-07-16 | 1990-07-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0434738U true JPH0434738U (en) | 1992-03-23 |
Family
ID=31617877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7642190U Pending JPH0434738U (en) | 1990-07-16 | 1990-07-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0434738U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011023546A (en) * | 2009-07-16 | 2011-02-03 | Shin Etsu Polymer Co Ltd | Electronic component holder and method for using the same |
-
1990
- 1990-07-16 JP JP7642190U patent/JPH0434738U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011023546A (en) * | 2009-07-16 | 2011-02-03 | Shin Etsu Polymer Co Ltd | Electronic component holder and method for using the same |
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