JPH0487648U - - Google Patents
Info
- Publication number
- JPH0487648U JPH0487648U JP13021190U JP13021190U JPH0487648U JP H0487648 U JPH0487648 U JP H0487648U JP 13021190 U JP13021190 U JP 13021190U JP 13021190 U JP13021190 U JP 13021190U JP H0487648 U JPH0487648 U JP H0487648U
- Authority
- JP
- Japan
- Prior art keywords
- conductive substrate
- wafer
- circumferential side
- fixed
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 4
Description
第１図はこの考案の一実施例であるウエハ支持
装置を示す平面図、第２図は第１図の断面図、第
３図ａ，ｂはこの考案の他の実施例を示す断面図
、第４図は従来のウエハの形状を示す断面図であ
る。
図において、１は薄板ウエハ、２は導電性基板
、３はウエハ固定用金属薄板、４は貫通孔、５は
吸引気流、６はピンを示す。なお、図中、同一符
号は同一、又は相当部分を示す。
FIG. 1 is a plan view showing a wafer support device which is an embodiment of this invention, FIG. 2 is a sectional view of FIG. 1, and FIGS. 3a and 3b are sectional views showing another embodiment of this invention. FIG. 4 is a sectional view showing the shape of a conventional wafer. In the figure, 1 is a thin wafer, 2 is a conductive substrate, 3 is a thin metal plate for fixing the wafer, 4 is a through hole, 5 is a suction airflow, and 6 is a pin. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
性基板と、この導電性基板上に搭載されたウエハ
の外周を取り囲むように外周側で前記導電性基板
に可動状に固定され、内周側でお互いに隣りと連
結されている複数のウエハ固定用金属薄板からな
ることを特徴とするウエハ支持装置。 A conductive substrate large enough to accommodate a thin wafer, movably fixed to the conductive substrate on the outer circumferential side so as to surround the outer circumference of the wafer mounted on the conductive substrate, and fixed to the conductive substrate on the inner circumferential side in a movable manner. A wafer support device comprising a plurality of thin metal plates for fixing wafers connected to one another.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13021190U JPH0487648U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13021190U JPH0487648U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0487648U true JPH0487648U (en) | 1992-07-30 |
Family
ID=31877569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13021190U Pending JPH0487648U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0487648U (en) |
-
1990
- 1990-11-30 JP JP13021190U patent/JPH0487648U/ja active Pending