JPH0312439U - - Google Patents

Info

Publication number
JPH0312439U
JPH0312439U JP7285189U JP7285189U JPH0312439U JP H0312439 U JPH0312439 U JP H0312439U JP 7285189 U JP7285189 U JP 7285189U JP 7285189 U JP7285189 U JP 7285189U JP H0312439 U JPH0312439 U JP H0312439U
Authority
JP
Japan
Prior art keywords
base
semiconductor wafer
fixed roller
roller pins
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7285189U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7285189U priority Critical patent/JPH0312439U/ja
Publication of JPH0312439U publication Critical patent/JPH0312439U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図aは本考案の実施例1を示す平面図、第
1図b,cは同断面図、第2図は本考案の実施例
2を示す断面図、第3図a,bは従来のウエハー
位置決め装置を示す平面図である。 1a,1b……固定ローラピン、2……ベース
、3……チヤツク、3b……昇降機構、4a,4
b……カム、4……回転リング、5……モータ、
7a,7b……ウエハー、8……プツシユローラ
ピン。
Figure 1a is a plan view showing Embodiment 1 of the present invention, Figures 1b and c are sectional views of the same, Figure 2 is a sectional view of Embodiment 2 of the invention, and Figures 3a and b are conventional FIG. 2 is a plan view showing a wafer positioning device of FIG. 1a, 1b...fixed roller pin, 2...base, 3...chuck, 3b...lifting mechanism, 4a, 4
b...Cam, 4...Rotating ring, 5...Motor,
7a, 7b...Wafer, 8...Push roller pin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ベースと、前記ベース上に半導体ウエハーの厚
み分ずつ高さを異ならせて整列した半導体ウエハ
ー位置決め用固定ローラピンの組と、前記固定ロ
ーラピンを受け入れるピン孔を備え前記ベースに
対し昇降する半導体ウエハー載置用チヤツクとを
有することを特徴とする投影露光装置の半導体ウ
エハー位置決め装置。
a base, a set of fixed roller pins for positioning semiconductor wafers arranged on the base at different heights corresponding to the thickness of the semiconductor wafer, and a semiconductor wafer mounting device that is provided with a pin hole for receiving the fixed roller pins and that moves up and down with respect to the base. 1. A semiconductor wafer positioning device for a projection exposure apparatus, characterized in that it has a chuck.
JP7285189U 1989-06-21 1989-06-21 Pending JPH0312439U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7285189U JPH0312439U (en) 1989-06-21 1989-06-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7285189U JPH0312439U (en) 1989-06-21 1989-06-21

Publications (1)

Publication Number Publication Date
JPH0312439U true JPH0312439U (en) 1991-02-07

Family

ID=31611156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7285189U Pending JPH0312439U (en) 1989-06-21 1989-06-21

Country Status (1)

Country Link
JP (1) JPH0312439U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002080267A (en) * 2000-09-08 2002-03-19 Yoshiteru Matsubara Porous ceramic and its manufacturing method
JP2008192963A (en) * 2007-02-07 2008-08-21 Oki Electric Ind Co Ltd Positioning method of guide member and positioning method of substrate
JP2009054269A (en) * 2007-08-02 2009-03-12 Ricoh Co Ltd Rotation mechanism and electron beam lithography device
JP2012028814A (en) * 2011-10-24 2012-02-09 Lintec Corp Sheet peeling device
JP2015095542A (en) * 2013-11-12 2015-05-18 株式会社ディスコ Positioning table
JP2017069263A (en) * 2015-09-28 2017-04-06 株式会社Screenホールディングス Substrate holding device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002080267A (en) * 2000-09-08 2002-03-19 Yoshiteru Matsubara Porous ceramic and its manufacturing method
JP4489919B2 (en) * 2000-09-08 2010-06-23 善輝 松原 Method for producing porous ceramics
JP2008192963A (en) * 2007-02-07 2008-08-21 Oki Electric Ind Co Ltd Positioning method of guide member and positioning method of substrate
JP2009054269A (en) * 2007-08-02 2009-03-12 Ricoh Co Ltd Rotation mechanism and electron beam lithography device
JP2012028814A (en) * 2011-10-24 2012-02-09 Lintec Corp Sheet peeling device
JP2015095542A (en) * 2013-11-12 2015-05-18 株式会社ディスコ Positioning table
JP2017069263A (en) * 2015-09-28 2017-04-06 株式会社Screenホールディングス Substrate holding device

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