JPH0412647U - - Google Patents

Info

Publication number
JPH0412647U
JPH0412647U JP5345590U JP5345590U JPH0412647U JP H0412647 U JPH0412647 U JP H0412647U JP 5345590 U JP5345590 U JP 5345590U JP 5345590 U JP5345590 U JP 5345590U JP H0412647 U JPH0412647 U JP H0412647U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
fixing
semiconductor
fixing jig
device manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5345590U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5345590U priority Critical patent/JPH0412647U/ja
Publication of JPH0412647U publication Critical patent/JPH0412647U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ〜ｃは本考案の一実施例の断面概略図
、第２図ａ，ｂは従来技術の断面概略図である。 １０１……半導体ウエーハ（サイズＡ）、１０
２，１０３……半導体ウエーハ固定用クランパー
、１０４……半導体装置製造装置処理台、１０７
……クランパーアームＢ用溝、１０８……クラン
パーアームＢ、１０９……クランパーアームＡ、
１１０……半導体ウエーハ（サイズＢ）、２０１
……半導体ウエーハ、２０２，２０３……半導体
ウエーハ固定用クランパー（サイズＡ用）、２０
４……半導体製造装置処理台、２０７……半導体
ウエーハ（サイズＢ）、２０８，２０９……半導
体ウエーハ固定用クランパー（サイズＢ用）。 1A to 1C are schematic cross-sectional views of one embodiment of the present invention, and FIGS. 2A and 2B are schematic cross-sectional views of the prior art. 101...Semiconductor wafer (size A), 10
2,103... Semiconductor wafer fixing clamper, 104... Semiconductor device manufacturing equipment processing table, 107
...Groove for clamper arm B, 108...Clamper arm B, 109...Clamper arm A,
110...Semiconductor wafer (size B), 201
... Semiconductor wafer, 202, 203 ... Clamper for fixing semiconductor wafer (for size A), 20
4... Semiconductor manufacturing equipment processing table, 207... Semiconductor wafer (size B), 208, 209... Semiconductor wafer fixing clamper (for size B).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ウエーハ固定用治具を有する半導体装置
の製造装置において、固定治具はサイズの異なる
半導体ウエーハを固定できる機構を有することを
特徴とする半導体装置の製造装置。 1. A semiconductor device manufacturing apparatus having a semiconductor wafer fixing jig, wherein the fixing jig has a mechanism capable of fixing semiconductor wafers of different sizes.
JP5345590U 1990-05-22 1990-05-22 Pending JPH0412647U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5345590U JPH0412647U (en) 1990-05-22 1990-05-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5345590U JPH0412647U (en) 1990-05-22 1990-05-22

Publications (1)

Publication Number Publication Date
JPH0412647U true JPH0412647U (en) 1992-01-31

Family

ID=31574654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5345590U Pending JPH0412647U (en) 1990-05-22 1990-05-22

Country Status (1)

Country Link
JP (1) JPH0412647U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53126589U (en) * 1977-03-17 1978-10-07

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0160539B2 (en) * 1981-04-15 1989-12-22 Ebara Mfg

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0160539B2 (en) * 1981-04-15 1989-12-22 Ebara Mfg

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53126589U (en) * 1977-03-17 1978-10-07

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