JPH0189744U - - Google Patents
Info
- Publication number
- JPH0189744U JPH0189744U JP18696887U JP18696887U JPH0189744U JP H0189744 U JPH0189744 U JP H0189744U JP 18696887 U JP18696887 U JP 18696887U JP 18696887 U JP18696887 U JP 18696887U JP H0189744 U JPH0189744 U JP H0189744U
- Authority
- JP
- Japan
- Prior art keywords
- vacuum chuck
- die
- die bonding
- bonding apparatus
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Description
第１図は、この考案の一実施例によるダイボン
ド装置の真空チヤツク支持部の構成を示す斜視図
、第２図は真空チヤツクによりダイを吸着して基
板に接着する状況を示す側面図、第３図は従来の
ダイボンド装置の真空チヤツク部の構成を示す斜
視図、第４図はダイコレツトにダイを真空吸着し
た状況を示す側面図、第５図は第４図の状態でダ
イを基板に接着する状況を示す側面図である。
図において１は真空チヤツク、２はダイコレツ
ト、３はスピンドル、４はスリーブ、６はダイ、
７は基板、８は接着剤、９は水平軸、１０は支持
枠、５は搬送アーム軸である。なお、図中、同一
符号は同一、又は相当部分を示す。
FIG. 1 is a perspective view showing the structure of a vacuum chuck support part of a die bonding apparatus according to an embodiment of the invention, FIG. The figure is a perspective view showing the configuration of the vacuum chuck section of a conventional die bonding device, Figure 4 is a side view showing the situation where the die is vacuum-suctioned to the die collet, and Figure 5 is the die bonded to the substrate in the state shown in Figure 4. FIG. 3 is a side view showing the situation. In the figure, 1 is a vacuum chuck, 2 is a die collet, 3 is a spindle, 4 is a sleeve, 6 is a die,
7 is a substrate, 8 is an adhesive, 9 is a horizontal axis, 10 is a support frame, and 5 is a transport arm axis. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
動可能であり、上記真空キヤツクが上下動方向に
対して互いに垂直な２軸のまわりに回転自在に支
持されていることを特徴とするダイボンド装置。 A die bonding apparatus characterized in that a vacuum chuck for adsorbing a semiconductor element is movable up and down, and the vacuum chuck is rotatably supported around two axes perpendicular to each other with respect to the direction of vertical movement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18696887U JPH0189744U (en) | 1987-12-07 | 1987-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18696887U JPH0189744U (en) | 1987-12-07 | 1987-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0189744U true JPH0189744U (en) | 1989-06-13 |
Family
ID=31478161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18696887U Pending JPH0189744U (en) | 1987-12-07 | 1987-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0189744U (en) |
-
1987
- 1987-12-07 JP JP18696887U patent/JPH0189744U/ja active Pending