JPS6333630U

JPS6333630U -

Info

Publication number: JPS6333630U
Application number: JP12750386U
Authority: JP
Priority date: 1986-08-20
Filing date: 1986-08-20
Publication date: 1988-03-04

Description

[Brief explanation of the drawing]

第１図は本考案装置の概略構造を例示する斜視
図である。第２図はキヤリヤの略示正面図、第３
図はその一部破断側面図である。また第４図はボ
ートの斜視図である。１……半導体ウエーハ、２……キヤリヤ、６…
…ボート、５，７……半導体ウエーハの挿入支持
溝、１０……ボート補助治具、１２……半導体ウ
エーハの挿通溝、１５……押圧装置、１６ａ，１
６ｂ……加圧ロツド。 FIG. 1 is a perspective view illustrating the schematic structure of the device of the present invention. Figure 2 is a schematic front view of the carrier;
The figure is a partially cutaway side view. FIG. 4 is a perspective view of the boat. 1... Semiconductor wafer, 2... Carrier, 6...
... Boat, 5, 7 ... Semiconductor wafer insertion support groove, 10 ... Boat auxiliary jig, 12 ... Semiconductor wafer insertion groove, 15 ... Pressing device, 16a, 1
6b...Pressure rod.

Claims

[Scope of utility model registration request]

A boat auxiliary jig that transfers semiconductor wafers between a carrier and a boat placed on a support stand with the semiconductor wafer insertion support groove oriented horizontally, and a pressing device that simultaneously moves the semiconductor wafers from the carrier to the boat or from the boat to the carrier via the boat auxiliary jig, and the boat auxiliary jig is provided at the same pitch as the semiconductor wafer insertion support grooves of the carrier and the boat. A semiconductor manufacturing device characterized in that a semiconductor wafer insertion groove is provided.