JPS61121739U - - Google Patents
Info
- Publication number
- JPS61121739U JPS61121739U JP337685U JP337685U JPS61121739U JP S61121739 U JPS61121739 U JP S61121739U JP 337685 U JP337685 U JP 337685U JP 337685 U JP337685 U JP 337685U JP S61121739 U JPS61121739 U JP S61121739U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafers
- jig
- grooves
- jig body
- storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 claims 3
- 238000009434 installation Methods 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Warehouses Or Storage Devices (AREA)
Description
第１図は本考案による半導体ウエハー用収納治
具の実施例を示す斜視図、第２図ａ，ｂは従来の
収納治具を示す斜視図である。
１１……ウエハー収納溝、１２……キヤリア上
面、１３……キヤリア底面、１４……スペーサー
、１５……キヤリア。
FIG. 1 is a perspective view showing an embodiment of a semiconductor wafer storage jig according to the present invention, and FIGS. 2A and 2B are perspective views showing a conventional storage jig. 11... Wafer storage groove, 12... Carrier top surface, 13... Carrier bottom surface, 14... Spacer, 15... Carrier.
Claims (1)
を治具本体に平行に備えた半導体ウエハー用収納
治具において、前記各溝を治具本体の設置面に対
し一定角度で傾斜させたことを特徴とする半導体
ウエハー用収納治具。 A storage jig for semiconductor wafers having a plurality of grooves parallel to the jig body for storing semiconductor wafers in a leaning manner, characterized in that each of the grooves is inclined at a constant angle with respect to the installation surface of the jig body. Storage jig for semiconductor wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP337685U JPS61121739U (en) | 1985-01-14 | 1985-01-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP337685U JPS61121739U (en) | 1985-01-14 | 1985-01-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61121739U true JPS61121739U (en) | 1986-07-31 |
Family
ID=30477944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP337685U Pending JPS61121739U (en) | 1985-01-14 | 1985-01-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61121739U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015173171A (en) * | 2014-03-11 | 2015-10-01 | セイコーインスツル株式会社 | Wafer carrier and method for taking out wafer from wafer carrier |
-
1985
- 1985-01-14 JP JP337685U patent/JPS61121739U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015173171A (en) * | 2014-03-11 | 2015-10-01 | セイコーインスツル株式会社 | Wafer carrier and method for taking out wafer from wafer carrier |