JPH0193738U - - Google Patents
Info
- Publication number
- JPH0193738U JPH0193738U JP18900587U JP18900587U JPH0193738U JP H0193738 U JPH0193738 U JP H0193738U JP 18900587 U JP18900587 U JP 18900587U JP 18900587 U JP18900587 U JP 18900587U JP H0193738 U JPH0193738 U JP H0193738U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- protrusion
- hole
- groove portion
- wafer cassette
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 5
Description
第１図はこの考案の一実施例による半導体ウエ
ハカセツトを示す斜視図で、第２図は第１図の縦
断面図、第３図は従来の半導体ウエハカセツトを
示す斜視図である。
図において、１はＵ字形ブロツク、２は半導体
ウエハを収納する収納溝部、３は半導体ウエハの
収納溝部２のピツチ寸法、４はＵ字形ブロツクを
組立てる際の突起部、５はＵ字形ブロツクを組立
てる際の穴部、６は半導体ウエハを示す。なお、
図中、同一符号は同一、又は相当部分を示す。
FIG. 1 is a perspective view showing a semiconductor wafer cassette according to an embodiment of this invention, FIG. 2 is a longitudinal sectional view of FIG. 1, and FIG. 3 is a perspective view showing a conventional semiconductor wafer cassette. In the figure, 1 is a U-shaped block, 2 is a storage groove for storing semiconductor wafers, 3 is the pitch dimension of the storage groove 2 for semiconductor wafers, 4 is a projection when assembling the U-shaped block, and 5 is a part for assembling the U-shaped block. The hole 6 in the figure indicates a semiconductor wafer. In addition,
In the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
ら前記半導体ウエハを収納する溝部を有する半導
体ウエハカセツトにおいて、前記溝部に収納する
半導体ウエハの主面に対して平行の面に突起部と
穴部を有したＵ字形ブロツクを前記突起部と前記
穴部の嵌合にて複数個、組み合わせて構成したこ
とを特徴とする半導体ウエハカセツト。 A semiconductor wafer cassette having a groove portion for storing the semiconductor wafer while guiding an outer peripheral edge portion of the semiconductor wafer, the U having a protrusion portion and a hole portion on a surface parallel to the main surface of the semiconductor wafer to be stored in the groove portion. 1. A semiconductor wafer cassette, characterized in that a plurality of letter-shaped blocks are combined by fitting the protrusion and the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18900587U JPH0193738U (en) | 1987-12-11 | 1987-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18900587U JPH0193738U (en) | 1987-12-11 | 1987-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193738U true JPH0193738U (en) | 1989-06-20 |
Family
ID=31480064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18900587U Pending JPH0193738U (en) | 1987-12-11 | 1987-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193738U (en) |
-
1987
- 1987-12-11 JP JP18900587U patent/JPH0193738U/ja active Pending
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