JPH01160839U - - Google Patents
Info
- Publication number
- JPH01160839U JPH01160839U JP4960088U JP4960088U JPH01160839U JP H01160839 U JPH01160839 U JP H01160839U JP 4960088 U JP4960088 U JP 4960088U JP 4960088 U JP4960088 U JP 4960088U JP H01160839 U JPH01160839 U JP H01160839U
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- transporting
- storing
- semiconductor substrates
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 238000005192 partition Methods 0.000 description 1
Description
第１図および第２図はそれぞれ本考案の一実施
例を示す半導体基板運搬用キヤリアの断面図およ
びその一部拡大斜視図、第３図および第４図はそ
れぞれ本考案の他の実施例を示す半導体基板運搬
用キヤリアの断面図およびその一部拡大斜視図で
ある。
１…半導体基板、２…格納溝、３…仕切り、４
…キヤリア本体。
1 and 2 are a cross-sectional view and a partially enlarged perspective view of a carrier for transporting semiconductor substrates showing one embodiment of the present invention, and FIGS. 3 and 4 respectively show other embodiments of the present invention. FIG. 2 is a cross-sectional view and a partially enlarged perspective view of the carrier for transporting semiconductor substrates shown in FIG. 1... Semiconductor substrate, 2... Storage groove, 3... Partition, 4
...Carrier body.
Claims (1)
半導体基板運搬用キヤリアにおいて、前記半導体
基板を収納する溝幅が基板挿入部の一部で広げら
れテーパ形状とされていることを特徴とする半導
体基板運搬用キヤリア。 A carrier for transporting semiconductor substrates having two functions of transporting and storing semiconductor substrates, characterized in that the width of the groove for storing the semiconductor substrate is widened at a part of the substrate insertion part and has a tapered shape. Carrier for transportation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4960088U JPH01160839U (en) | 1988-04-12 | 1988-04-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4960088U JPH01160839U (en) | 1988-04-12 | 1988-04-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160839U true JPH01160839U (en) | 1989-11-08 |
Family
ID=31275690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4960088U Pending JPH01160839U (en) | 1988-04-12 | 1988-04-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160839U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115785A (en) * | 2005-10-18 | 2007-05-10 | Oki Electric Ind Co Ltd | Supporting container for thin plate |
| JP2008042155A (en) * | 2006-08-04 | 2008-02-21 | King Yuan Electronics Co Ltd | Auxiliary device of wafer cassette |
-
1988
- 1988-04-12 JP JP4960088U patent/JPH01160839U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115785A (en) * | 2005-10-18 | 2007-05-10 | Oki Electric Ind Co Ltd | Supporting container for thin plate |
| JP2008042155A (en) * | 2006-08-04 | 2008-02-21 | King Yuan Electronics Co Ltd | Auxiliary device of wafer cassette |
| JP4496194B2 (en) * | 2006-08-04 | 2010-07-07 | 京元電子股▲ふん▼有限公司 | Wafer cassette auxiliary equipment |