JPH01116444U - - Google Patents

Info

Publication number
JPH01116444U
JPH01116444U JP1247988U JP1247988U JPH01116444U JP H01116444 U JPH01116444 U JP H01116444U JP 1247988 U JP1247988 U JP 1247988U JP 1247988 U JP1247988 U JP 1247988U JP H01116444 U JPH01116444 U JP H01116444U
Authority
JP
Japan
Prior art keywords
wafer carrier
end portion
semiconductor processing
semiconductor
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1247988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1247988U priority Critical patent/JPH01116444U/ja
Publication of JPH01116444U publication Critical patent/JPH01116444U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係る半導体ウエハキヤリアの
実施例を示す斜視図、第2図は従来用いられてい
る半導体ウエハキヤリアの斜視図を示す。 1……半導体ウエハキヤリア、2,3……キヤ
リア上枠、4,5……突起、6,7……溝、11
……半導体ウエハキヤリア、12,15……キヤ
リア上枠、13,16……突起、14,17……
溝。
FIG. 1 is a perspective view showing an embodiment of a semiconductor wafer carrier according to the present invention, and FIG. 2 is a perspective view of a conventional semiconductor wafer carrier. 1... Semiconductor wafer carrier, 2, 3... Carrier upper frame, 4, 5... Protrusion, 6, 7... Groove, 11
...Semiconductor wafer carrier, 12,15...Carrier upper frame, 13,16...Protrusion, 14,17...
groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体プロセス用ウエハキヤリアの半導体ウエ
ハ挿入部である上端部において、前記上端部の四
隅の対角状に突起部分あるいは溝部分を設けたこ
とを特徴とするウエハキヤリア。
A wafer carrier for semiconductor processing, characterized in that an upper end portion, which is a semiconductor wafer insertion portion, of the wafer carrier for semiconductor processing is provided with protruding portions or groove portions diagonally at four corners of the upper end portion.
JP1247988U 1988-02-01 1988-02-01 Pending JPH01116444U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1247988U JPH01116444U (en) 1988-02-01 1988-02-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1247988U JPH01116444U (en) 1988-02-01 1988-02-01

Publications (1)

Publication Number Publication Date
JPH01116444U true JPH01116444U (en) 1989-08-07

Family

ID=31221952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1247988U Pending JPH01116444U (en) 1988-02-01 1988-02-01

Country Status (1)

Country Link
JP (1) JPH01116444U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60117610A (en) * 1983-11-30 1985-06-25 Kakizaki Seisakusho:Kk Basket for wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60117610A (en) * 1983-11-30 1985-06-25 Kakizaki Seisakusho:Kk Basket for wafer

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