JPS63191634U - - Google Patents
Info
- Publication number
- JPS63191634U JPS63191634U JP8234087U JP8234087U JPS63191634U JP S63191634 U JPS63191634 U JP S63191634U JP 8234087 U JP8234087 U JP 8234087U JP 8234087 U JP8234087 U JP 8234087U JP S63191634 U JPS63191634 U JP S63191634U
- Authority
- JP
- Japan
- Prior art keywords
- section
- clamper
- support ring
- spring
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
Landscapes
- Drying Of Semiconductors (AREA)
Description
第１図ａは本考案の第１の実施例を示す縦断面
図、第１図ｂは同横断面図、第２図は第１図のク
ランプ治具をドライエツチング装置に適用した第
２の実施例を示す断面図、第３図ａは従来の半導
体ウエハークランプ治具の縦断面図、第３図ｂは
同横断面図である。
１，１１……半導体ウエハー、２……支持リン
グ、３……バネ、４……クランパー部、５……ウ
エハー載置ステージ。
FIG. 1a is a longitudinal sectional view showing the first embodiment of the present invention, FIG. 1b is a cross-sectional view of the same, and FIG. 2 is a second embodiment in which the clamp jig of FIG. FIG. 3A is a longitudinal cross-sectional view of a conventional semiconductor wafer clamp jig, and FIG. 3B is a cross-sectional view of the same. 1, 11... Semiconductor wafer, 2... Support ring, 3... Spring, 4... Clamper section, 5... Wafer mounting stage.
Claims (1)
さえ付けるクランパー部と、クランパー部を支持
する支持リングと、該クランパー部と支持リング
とを連結してなるバネとから構成される半導体ウ
エハークランプ治具において、前記クランパー部
を複数個に分割し、該クランパー部の各々をバネ
にて支持リングに支持させたことを特徴とする半
導体ウエハークランプ治具。 A semiconductor wafer clamp jig comprising a wafer mounting section, a clamper section that directly presses the wafer against the mounting section, a support ring that supports the clamper section, and a spring that connects the clamper section and the support ring. . A semiconductor wafer clamp jig, characterized in that the clamper section is divided into a plurality of parts, and each of the clamper parts is supported by a support ring with a spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8234087U JPS63191634U (en) | 1987-05-29 | 1987-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8234087U JPS63191634U (en) | 1987-05-29 | 1987-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63191634U true JPS63191634U (en) | 1988-12-09 |
Family
ID=30934905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8234087U Pending JPS63191634U (en) | 1987-05-29 | 1987-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63191634U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02120746U (en) * | 1989-03-17 | 1990-09-28 |
-
1987
- 1987-05-29 JP JP8234087U patent/JPS63191634U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02120746U (en) * | 1989-03-17 | 1990-09-28 |