JPS6420744U - - Google Patents
Info
- Publication number
- JPS6420744U JPS6420744U JP11600287U JP11600287U JPS6420744U JP S6420744 U JPS6420744 U JP S6420744U JP 11600287 U JP11600287 U JP 11600287U JP 11600287 U JP11600287 U JP 11600287U JP S6420744 U JPS6420744 U JP S6420744U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- surface part
- lead frame
- outer peripheral
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Die Bonding (AREA)
Description
第１図は、この考案の一実施例による半導体装
置用リードフレームを示す部分図、第２図はその
断面図、第３図は従来のこの種のリードフレーム
を示す部分図、第４図はその断面図である。図中
、１はリードフレーム、２は宙吊りリード、３は
ダイパツトリード、４は位置決メ用穴、５は溝で
ある。尚、図中同一符号は同一、又は相当部分を
示す。
FIG. 1 is a partial view showing a lead frame for a semiconductor device according to an embodiment of the invention, FIG. 2 is a sectional view thereof, FIG. 3 is a partial view showing a conventional lead frame of this type, and FIG. FIG. In the figure, 1 is a lead frame, 2 is a suspended lead, 3 is a die part lead, 4 is a hole for positioning, and 5 is a groove. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
ームにおいて、半導体素子搭載部の上面部に、そ
の面部の中心点より外周部内側の範囲に放射状に
溝部を設けたことを特徴とする半導体装置用リー
ドフレーム。 A lead frame for a semiconductor device on which a semiconductor element can be mounted, characterized in that a groove section is provided radially in the upper surface part of the semiconductor element mounting part in a range from the center point of the surface part to the inside of the outer peripheral part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11600287U JPS6420744U (en) | 1987-07-28 | 1987-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11600287U JPS6420744U (en) | 1987-07-28 | 1987-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6420744U true JPS6420744U (en) | 1989-02-01 |
Family
ID=31358162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11600287U Pending JPS6420744U (en) | 1987-07-28 | 1987-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6420744U (en) |
-
1987
- 1987-07-28 JP JP11600287U patent/JPS6420744U/ja active Pending
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