JPS6448037U - - Google Patents
Info
- Publication number
- JPS6448037U JPS6448037U JP14397887U JP14397887U JPS6448037U JP S6448037 U JPS6448037 U JP S6448037U JP 14397887 U JP14397887 U JP 14397887U JP 14397887 U JP14397887 U JP 14397887U JP S6448037 U JPS6448037 U JP S6448037U
- Authority
- JP
- Japan
- Prior art keywords
- central portion
- seal ring
- ceramic substrate
- multilayer ceramic
- outer periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
第１図ａおよびｂはそれぞれ本考案の一実施例
の縦断面図およびキヤツプ取付け時の拡大縦断面
図、第２図ａおよびｂはそれぞれ従来の一例の縦
断面図およびキヤツプ取付け時の拡大縦断面図で
ある。
１……多層セラミツク基板、２……シールリン
グ、３……キヤツプ。
Figures 1a and b are a vertical cross-sectional view of an embodiment of the present invention and an enlarged vertical cross-sectional view when the cap is installed, and Figures 2 a and b are a vertical cross-sectional view and an enlarged vertical cross-sectional view of a conventional example when the cap is installed, respectively. It is a front view. 1...Multilayer ceramic substrate, 2...Seal ring, 3...Cap.
Claims (1)
の外周部にシールリングとを有し、このシールリ
ング上にキヤツプを封着する多層セラミツク基板
において、前記外周部上面を中央部分上面より一
段低い位置とし、この外周部に取付けられたシー
リング上面も中央部分上面より低い位置にあるよ
うにしたことを特徴とする多層セラミツク基板。 In a multilayer ceramic substrate having a central portion on which an LSI chip is mounted and a seal ring on the outer periphery thereof, and a cap is sealed onto the seal ring, the upper surface of the outer periphery is positioned one step lower than the upper surface of the central portion. A multilayer ceramic substrate characterized in that the upper surface of the sealing member attached to the outer peripheral portion is also located at a lower position than the upper surface of the central portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14397887U JPS6448037U (en) | 1987-09-21 | 1987-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14397887U JPS6448037U (en) | 1987-09-21 | 1987-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448037U true JPS6448037U (en) | 1989-03-24 |
Family
ID=31411282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14397887U Pending JPS6448037U (en) | 1987-09-21 | 1987-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448037U (en) |
-
1987
- 1987-09-21 JP JP14397887U patent/JPS6448037U/ja active Pending