JPH0238747U - - Google Patents
Info
- Publication number
- JPH0238747U JPH0238747U JP1988118110U JP11811088U JPH0238747U JP H0238747 U JPH0238747 U JP H0238747U JP 1988118110 U JP1988118110 U JP 1988118110U JP 11811088 U JP11811088 U JP 11811088U JP H0238747 U JPH0238747 U JP H0238747U
- Authority
- JP
- Japan
- Prior art keywords
- container
- metal
- ceramic
- base
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000005394 sealing glass Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Description
第１図は本考案の一実施例の縦断面図、第２図
は本考案の他の実施例の縦断面図、第３図は従来
の容器の縦断面図である。
１……セラミツクキヤツプ、２……封止ガラス
、３……リードフレーム、４……半導体チツプ、
５……セラミツクベース、６……金属製ベース。
FIG. 1 is a vertical cross-sectional view of one embodiment of the present invention, FIG. 2 is a vertical cross-sectional view of another embodiment of the present invention, and FIG. 3 is a vertical cross-sectional view of a conventional container. 1... Ceramic cap, 2... Sealing glass, 3... Lead frame, 4... Semiconductor chip,
5...Ceramic base, 6...Metal base.
Claims (1)
型半導体装置用容器において、半導体チツプ搭載
領域下の前記ベースを金属で置き換え、該金属を
前記容器の外表面の一部とすることを特徴とする
半導体装置用容器。 A glass-sealed container for a semiconductor device having a base made of ceramic, wherein the base below the semiconductor chip mounting area is replaced with metal, and the metal becomes part of the outer surface of the container. container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988118110U JPH0238747U (en) | 1988-09-07 | 1988-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988118110U JPH0238747U (en) | 1988-09-07 | 1988-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0238747U true JPH0238747U (en) | 1990-03-15 |
Family
ID=31362177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988118110U Pending JPH0238747U (en) | 1988-09-07 | 1988-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238747U (en) |
-
1988
- 1988-09-07 JP JP1988118110U patent/JPH0238747U/ja active Pending