JPH0193745U - - Google Patents
Info
- Publication number
- JPH0193745U JPH0193745U JP19123887U JP19123887U JPH0193745U JP H0193745 U JPH0193745 U JP H0193745U JP 19123887 U JP19123887 U JP 19123887U JP 19123887 U JP19123887 U JP 19123887U JP H0193745 U JPH0193745 U JP H0193745U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- ceramic base
- external leads
- ceramic package
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図Ａは本考案のセラミツクパツケージの一
例を示す断面図、Ｂはその平面図、第２図は本考
案の他の実施例を示す断面図、第３図Ａは従来の
セラミツクパツケージの断面図、Ｂはその平面図
を示す。
１……セラミツク基体、２……セラミツク基体
の外側面、３……外部リード、４……外部リード
の外端、５……半導体素子収納穴、１０……セラ
ミツクパツケージ本体。
FIG. 1A is a sectional view showing an example of the ceramic package of the present invention, B is a plan view thereof, FIG. 2 is a sectional view showing another embodiment of the present invention, and FIG. 3A is a sectional view of a conventional ceramic package. Figure B shows its plan view. DESCRIPTION OF SYMBOLS 1... Ceramic base, 2... Outer surface of ceramic base, 3... External lead, 4... Outer end of external lead, 5... Semiconductor element storage hole, 10... Ceramic package body.
Claims (1)
収納穴を有するとともに、該セラミツク基体の側
方に延在する外部リードを固着したセラミツクパ
ツケージにおいて、該外部リードの外端が、前記
セラミツク基体の外側面より内側に位置すること
を特徴とするセラミツクパツケージ。 In a ceramic package having a semiconductor element storage hole on the upper or lower surface of a ceramic base and having external leads fixed thereto extending laterally of the ceramic base, the outer ends of the external leads are located inside the outer surface of the ceramic base. A ceramic package characterized by being located in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19123887U JPH0193745U (en) | 1987-12-16 | 1987-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19123887U JPH0193745U (en) | 1987-12-16 | 1987-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193745U true JPH0193745U (en) | 1989-06-20 |
Family
ID=31482161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19123887U Pending JPH0193745U (en) | 1987-12-16 | 1987-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193745U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57181144A (en) * | 1981-05-01 | 1982-11-08 | Toshiba Corp | Semiconductor device |
-
1987
- 1987-12-16 JP JP19123887U patent/JPH0193745U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57181144A (en) * | 1981-05-01 | 1982-11-08 | Toshiba Corp | Semiconductor device |