JPS61134046U - - Google Patents
Info
- Publication number
- JPS61134046U JPS61134046U JP1668985U JP1668985U JPS61134046U JP S61134046 U JPS61134046 U JP S61134046U JP 1668985 U JP1668985 U JP 1668985U JP 1668985 U JP1668985 U JP 1668985U JP S61134046 U JPS61134046 U JP S61134046U
- Authority
- JP
- Japan
- Prior art keywords
- glass
- ceramic
- semiconductor device
- sealed
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 230000008018 melting Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の部分斜視図、第２
図と第３図は従来の半導体装置の一例および他の
例の側面図、第４図は従来の半導体装置のリード
変形例を示すための部分斜視図である。
１……セラミツク基体、２……低融点ガラス、
３，４……外部リード、５……キヤツプ、６……
リード曲り防止用ストツパ。
Fig. 1 is a partial perspective view of one embodiment of the present invention;
3 and 3 are side views of one example and another example of a conventional semiconductor device, and FIG. 4 is a partial perspective view showing a modification of the lead of the conventional semiconductor device. 1... Ceramic substrate, 2... Low melting point glass,
3, 4...External lead, 5...Cap, 6...
Stopper to prevent lead bending.
Claims (1)
ードならびにセラミツクキヤツプが封着され、か
つ、前記外部リードが前記セラミツク基体の側面
から底面に折り曲げられた形状のガラス封止型半
導体装置において、隣接する前記外部リード間の
セラミツク基体底面上に、結晶質ガラスから成る
リード曲がり防止用ストツパを有していることを
特徴とするガラス封止型半導体装置。 In a glass-sealed semiconductor device in which an external lead and a ceramic cap are sealed to a ceramic base via a low-melting glass, and the external lead is bent from the side surface to the bottom surface of the ceramic base, the adjacent external 1. A glass-sealed semiconductor device comprising a stopper made of crystalline glass for preventing lead bending on the bottom surface of a ceramic substrate between the leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1668985U JPS61134046U (en) | 1985-02-08 | 1985-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1668985U JPS61134046U (en) | 1985-02-08 | 1985-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61134046U true JPS61134046U (en) | 1986-08-21 |
Family
ID=30503697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1668985U Pending JPS61134046U (en) | 1985-02-08 | 1985-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61134046U (en) |
-
1985
- 1985-02-08 JP JP1668985U patent/JPS61134046U/ja active Pending
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