JPS61195070U - - Google Patents
Info
- Publication number
- JPS61195070U JPS61195070U JP1985077615U JP7761585U JPS61195070U JP S61195070 U JPS61195070 U JP S61195070U JP 1985077615 U JP1985077615 U JP 1985077615U JP 7761585 U JP7761585 U JP 7761585U JP S61195070 U JPS61195070 U JP S61195070U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- recessed portion
- circuit element
- element disposed
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Landscapes
- Optical Communication System (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Semiconductor Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の半導体装置の断面
図、第２図は光受信器の回路ブロツク構成図、第
３図は他の実施例の断面図である。
７，８……ＩＣチツプ、１１……凹部、１２…
…基板、１４……透光性窓、１５……シエル、１
６……コンデンサ。
FIG. 1 is a sectional view of a semiconductor device according to one embodiment of the present invention, FIG. 2 is a circuit block diagram of an optical receiver, and FIG. 3 is a sectional view of another embodiment. 7, 8...IC chip, 11...recess, 12...
...Substrate, 14...Translucent window, 15...Ciel, 1
6...Capacitor.
Claims (1)
され基板との間に空間を形成するシエルと、前記
凹部に配置された第１の回路素子と、前記凹部を
覆うように前記基板上に配置されたコンデンサ及
び前記凹部以外の基板上に配置された第２の回路
素子とを備えた半導体装置。 A substrate having a recessed portion, a shell that is airtightly joined to the substrate and forms a space between the substrate, a first circuit element disposed in the recessed portion, and a first circuit element disposed on the substrate so as to cover the recessed portion. A semiconductor device comprising: a capacitor formed by a cylindrical capacitor; and a second circuit element disposed on a substrate other than the recessed portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985077615U JPS61195070U (en) | 1985-05-27 | 1985-05-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985077615U JPS61195070U (en) | 1985-05-27 | 1985-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61195070U true JPS61195070U (en) | 1986-12-04 |
Family
ID=30620840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985077615U Pending JPS61195070U (en) | 1985-05-27 | 1985-05-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61195070U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02101642U (en) * | 1989-01-31 | 1990-08-13 |
-
1985
- 1985-05-27 JP JP1985077615U patent/JPS61195070U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02101642U (en) * | 1989-01-31 | 1990-08-13 |
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