JPS59151447U - Glass sealed package - Google Patents

Glass sealed package

Info

Publication number
JPS59151447U
JPS59151447U JP4501383U JP4501383U JPS59151447U JP S59151447 U JPS59151447 U JP S59151447U JP 4501383 U JP4501383 U JP 4501383U JP 4501383 U JP4501383 U JP 4501383U JP S59151447 U JPS59151447 U JP S59151447U
Authority
JP
Japan
Prior art keywords
lead
sealed package
glass sealed
glass
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4501383U
Other languages
Japanese (ja)
Inventor
茂 久保田
金田　賢一
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP4501383U priority Critical patent/JPS59151447U/en
Publication of JPS59151447U publication Critical patent/JPS59151447U/en
Pending legal-status Critical Current

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Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例の硝子封止型パッケージの部分
平面図、第２図は第１図のＡ−Ａ’部の断面図である。 尚、図において、１・′・・絶縁基板、２・・・キャビ
ィティ部、３・・・硝子材料、４・・・グランドピンと
なる端リード、５・・・他の端リード、６・・・リード
フレーム、である。FIG. 1 is a partial plan view of a glass-sealed package according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along line AA' in FIG. In the figure, 1... insulating substrate, 2... cavity part, 3... glass material, 4... end lead serving as a ground pin, 5... other end lead, 6... It is a lead frame.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を固着するキャビィティを有する絶縁基板上
に硝子材料・リードフレームを順次に取付けた硝子封止
型パッケージにおいて、前記硝子材料に固着するリード
フレームの内部リードのうち端リードの一本のリード表
面積が他リードの表面積の１．５〜４倍に形成され、か
つ該内部リードの各々の先端位置が前記絶縁基板の中心
に対して−略対象に位置することを特徴とする硝子封止
型パッケージ。In a glass-sealed package in which a glass material and a lead frame are sequentially attached to an insulating substrate having a cavity for fixing a semiconductor element, the lead surface area of one end lead among the internal leads of the lead frame fixed to the glass material. 1.5 to 4 times the surface area of the other leads, and the tip of each internal lead is positioned approximately symmetrically with respect to the center of the insulating substrate. .
JP4501383U 1983-03-29 1983-03-29 Glass sealed package Pending JPS59151447U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4501383U JPS59151447U (en) 1983-03-29 1983-03-29 Glass sealed package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4501383U JPS59151447U (en) 1983-03-29 1983-03-29 Glass sealed package

Publications (1)

Publication Number Publication Date
JPS59151447U true JPS59151447U (en) 1984-10-11

Family

ID=30175537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4501383U Pending JPS59151447U (en) 1983-03-29 1983-03-29 Glass sealed package

Country Status (1)

Country Link
JP (1) JPS59151447U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63105357U (en) * 1986-12-25 1988-07-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63105357U (en) * 1986-12-25 1988-07-08

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